SEOUL, South Korea, March 3, 2022 – Magnachip Semiconductor Corporation (NYSE: MX) (“Magnachip” or the “Company”) today announced that YJ Kim, Magnachip’s chief executive officer will participate at the 34th Annual Roth Conference on March 13-15, 2022, in Dana Point, California.

Magnachip Semiconductor to Participate at the 34th Annual Roth Conference

YJ Kim will participate in one-on-one and small group meetings with institutional investors on Monday, March 14 and Tuesday, March 15, 2022. There will be no formal presentation. For more information about the conference or to request a one-on-one meeting, please contact a Roth sales representative.

 

About Magnachip Semiconductor Corporation

Magnachip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, computing, industrial and automotive applications. The Company provides a broad range of standard products to customers worldwide. Magnachip with more than 40 years of operating history, owns a portfolio of approximately 1,150 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through Magnachip’s website is not a part of, and is not incorporated into, this release.

 

CONTACTS:
In the United States:
So-Yeon Jeong
Jeong Consulting
Tel. +1-408-712-6151
investor.relations@magnachip.com

 

In the Media

Cision PR Newswire: news distribution, targeting and monitoring home     Magnachip to Attend Upcoming Investor Conferences

    Magnachip Semiconductor to Participate at the 34th Annual Roth Conference

SEOUL, South Korea, Jan. 7, 2022 /PRNewswire/ — Magnachip Semiconductor Corporation (NYSE: MX) (“Magnachip” or the “Company”) today announced that YJ Kim, Magnachip’s chief executive officer, and Shinyoung Park, chief financial officer, will host one-on-one meetings at the 24th Annual Needham Virtual Growth Conference on Thursday, January 13 and Friday, January 14, 2022.  Management is also scheduled to participate in a fireside chat on Friday, January 14 at 4:15 pm ET in Track 3.

A live webcast of the fireside discussion will be accessible via the “Investors” section of the Company’s website at www.magnachip.com, and the webcast will be archived for 90 days following the live presentation.

For more information about the conference or to request a one-on-one, please contact your Needham representative.

 

About Magnachip Semiconductor Corporation

Magnachip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company provides a broad range of standard products to customers worldwide. Magnachip, with more than 40 years of operating history, owns a portfolio of approximately 1,200 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through Magnachip’s website is not a part of, and is not incorporated into, this release.

 

CONTACTS:
In the United States:
So-Yeon Jeong
Jeong Consulting
Tel. +1-408-712-6151
investor.relations@magnachip.com

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SOURCE Magnachip Semiconductor Corporation

SEOUL, South Korea, Jan. 3, 2022 /PRNewswire/ — Magnachip Semiconductor Corporation (“Magnachip” or the “Company”) (NYSE: MX) announced today that Ms. Shinyoung Park has been promoted to Chief Financial Officer, effective as of January 1, 2022.  Ms. Park succeeds Dr. Young Soo Woo, who stepped down from the position effective as of the end of December 31, 2021.

Ms. Park joined Magnachip in 2014 and served as Chief Accounting Officer from March 2020 to December 2021. She previously served as Corporate Controller from November 2018 to February 2020.  Prior to joining Magnachip, Ms. Park held various senior advisory and audit service positions for 10 years with Deloitte in three different locations—Chicago, Illinois, Seoul, South Korea, and London, U.K.  Ms. Park holds a B.A. degree in business administration from Sogang University, Seoul, Korea, and a Master’s degree in hospitality industry studies from New York University.

“I am excited to announce Shinyoung’s appointment, which is also a testament to the breadth of leadership within our organization, as well as our mission of empowering talented individuals,” said YJ Kim, Magnachip’s Chief Executive Officer.  “Shinyoung has long been a valued member of our executive team, who played a critical role in building the strong finance and accounting team we currently have at Magnachip.  We believe her extensive experience with the company, comprehensive understating of our operational disciplines, and expertise in finance and accounting matters will be instrumental to Magnachip as we continue executing our plan for sustainable and profitable growth and focusing on delivering long-term values.”

YJ Kim commented, “On behalf of the Board of Directors and the entire management team, I would like to thank Young Soo for the contributions he has made to Magnachip during his tenure.  We wish him the best in his future endeavors.”

 

About Magnachip Semiconductor Corporation

Magnachip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company provides a broad range of standard products to customers worldwide. Magnachip, with more than 40 years of operating history, owns a portfolio of approximately 1,200 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through Magnachip’s website is not a part of, and is not incorporated into, this release.

CONTACT:

So-Yeon Jeong
Head of Investor Relations
Tel. +1-408-712-6151
Investor.relations@maganachip.com

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SOURCE Magnachip Semiconductor Corporation

Symbolizes Magnachip’s profound commitment to technology advancement and customer support

SEOUL, South Korea, December 30, 2020 — Magnachip Semiconductor Corporation (NYSE: MX) (“Magnachip” or the “Company”) today unveiled its new brand identity, designed to highlight the company’s fresh start as a pure-play standard products company participating in the fast-growing, attractive Display and Power markets. Magnachip enters this new chapter of growth with a sharpened focus, renewed energy and clear mission of empowering the makers of tomorrow by accelerating the advancement of technology.

 

 

Over the past years, Magnachip has emerged as a significant supplier of choice for industry-leading technology companies in Display and Power markets based on a pioneering portfolio of premium products that have moved well beyond niche opportunities. The structural change into a fab-lite, pure-play standard products company significantly strengthens Magnachip’s operational and financial foundation, which in turn will fuel innovation, propel growth and enhance responsiveness to customer requirements.

“I am proud of our amazing team at Magnachip, who have delivered a successful transformation while weathering unprecedented challenges presented by the COVID-19 pandemic,” said YJ Kim, Magnachip’s chief executive officer. “This structural change is an integral part of the new Magnachip, and the new brand identity symbolizes our profound commitment to technology advancement and customer support. From consumer electronics to industrial devices, our innovations improve the way people live, work, play and communicate. Together with our customers, we’re powering the technology the world loves. Magnachip is Powering Magnificent Moments.”

 

About Magnachip Semiconductor

Magnachip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company provides a broad range of standard products to customers worldwide. With more than 40 years of operating history, Magnachip owns a portfolio of approximately 1,200 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. Please visit www.magnachip.com for more information. Information on or accessible from Magnachip’s website is not a part of, and is not incorporated into, this release.

 

CONTACTS:

United States (Investor Relations):
So-Yeon Jeong
Head of Investor Relations
Tel. +1-408-712-6151
Investor.relations@maganachip.com
Korea / Asia media:
Min A KIM
Senior manager of Public Relations
Tel. +82-2-6903-3392
pr@maganachip.com

SEOUL, South Korea and SAN JOSE, Calif., June 8, 2020 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX) today announced that members of the executive management team will participate in Citi’s Silicon Valley Virtual Investor Bus Tour on Friday, June 12. MagnaChip is expected to begin its presentation at 8:00 a.m. (PT).

To register for the event, qualified investors can contact their Citi Sales Representative.

 

 

About MagnaChip Semiconductor

MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with more than 40 years of operating history, owns a portfolio of approximately 2,950 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:
In the United States:
So-Yeon Jeong
Investor Relations
Tel: +1.408-712-6151

Bruce Entin
Investor Relations
Tel. +1.408.625.1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director, Public Relations
Tel. +82.2.6903.3195
chankeun.park@magnachip.com

 

Award by Korean Ministry of Industry, Trade and Energy Acknowledges Job Development and Investment from Foreign Companies

SEOUL, South Korea and SAN JOSE, Calif., Nov. 4, 2019 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today that CEO YJ Kim was awarded the Industrial Service Medal by the Korean Government in acknowledgement of his efforts to attract investment and encourage job development in Korea. The medal was presented today at the annual ‘Foreign Company Day’ ceremony hosted by the Korea Ministry of Industry, Trade and Energy, and the Korea Foreign Company Association (FORCA).  The ceremony, held at the Grand InterContinental Hotel in Seoul, Korea, was attended by 500 CEOs, executives, employees of global companies and government representatives.

Mr. Kim, a 30-year veteran in the high-tech industry, has held executive positions at leading semiconductor companies, including Intel, Samsung and Cavium.  He joined MagnaChip in 2013 and was appointed as CEO in 2015.  Under his leadership, MagnaChip’s revenue and profit have shown significant improvement, and the Company’s Display, Power and Foundry businesses each have achieved substantial market success.  The Company is widely recognized as one of the leading independent suppliers of OLED display drivers used in smartphones, and as an acknowledged leader in the design and production of Power semiconductors.  The Company operates two manufacturing facilities in Korea, including one that is a Foundry for fabless semiconductor companies.  The Company employs over 2,400 in three business sites in Korea, including Seoul, Cheongju and Gumi.  MagnaChip, with an almost 40-year history in Korea, went public on the New York Stock Exchange (NYSE) in 2011.

“I am very proud of the fact that MagnaChip Semiconductor has made a significant contribution to the Korean semiconductor industry and to the economy of Korea,” said YJ Kim, CEO of MagnaChip.  “I want to thank all of MagnaChip’s employees throughout Korea for their hard work and dedication.”

 

 

About Maganachip Semiconductor

Maganachip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company provides a broad range of standard products to customers worldwide. With more than 40 years of operating history, Maganachip owns a portfolio of approximately 1,200 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. Please visit www.Maganachip.com for more information. Information on or accessible from Maganachip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

USA media / industry analysts

Mike Newsom

LouVan Communications, Inc.

Tel. +1-617-803-5385

mike@louvanpr.com

Korea / Asia media:

Chankeun Park

Director of Public Relations

Tel. +82-2-6903-5223

chankeun.park@maganachip.com

MagnaChip Semiconductor to Present at the 2019 Citi Technology Conference on September 4, 2019 in New York City

 

SEOUL, South Korea and SAN JOSE, Calif., Aug. 16, 2019 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications, today announced that members of the executive management team will present to the investment community at the 2019 Citi Global Technology Conference in New York City on Wednesday, September 4 at 10:15 am EDT. The management team, including CEO YJ Kim and CFO Jonathan Kim, also will host 1:1 investor meetings with institutional investors.

An audio webcast of the presentation can be heard live on the MagnaChip website at (www.magnachip.com). The webcast link will appear in the “Investor Events” section (http://investors.magnachip.com/) under the Investors tab.

A replay of the webcast will be available one hour after the conclusion of the presentation and will be accessible on the MagnaChip website until December 4, 2019.

About MagnaChip Semiconductor Corporation
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with about 40 years of operating history, owns a portfolio of approximately 3,000 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:
In the United States:
Bruce Entin
Investor Relations
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., May 30, 2019 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today the offering of its second generation 0.13 micron eFlash (Embedded Flash) technology with 20V and 30V high-voltage options. The technology is specifically designed to address the needs for multi-function hybrid mixed-signal products, including touch ICs, fingerprint readout ICs and wireless power charger ICs.

With the growing complexity of analog and mixed-signal functions, IC designers are facing increasing challenges to integrate multiple functions in a single product. The wireless power charger ICs, for instance, include digital logic, analog blocks, power management functions, embedded microcontrollers, etc. In order to design and manufacture such multi-functional products, hybrid processes capable of integrating various devices have become highly desirable.

To meet these market needs, MagnaChip has developed a unique, cost-competitive hybrid process through the addition of 20V and 30V high-voltage options to its second generation 0.13 micron eFlash. The second generation 0.13 micron eFlash, which has high performing and highly reliable embedded Flash, is a cost competitive process as it reduced 7 process steps in comparison to the first generation 0.13 micron eFlash. It also provides various customized IPs up to 64Kbytes. Even with the addition of the high voltage option, the hybrid process maintains the original eFlash characteristics.

Additional benefit of this process is that customers can now select either 20V or 30V, whichever fits their products’ characteristics while having the option to choose IPs such as SRAM, PLL analog IPs, high density standard cell libraries and high voltage IO libraries to meet their design needs. Furthermore, the hybrid process provides fully isolated high-voltage capability for the output driver to handle negative voltage, thereby allowing higher design flexibility.

MagnaChip’s newly developed hybrid process uses the high-voltage devices of which reliability has already been verified in DDI (Display Driver IC) technology and can minimize high-voltage area in chips through more optimized design rules and enhanced current performance. This high-voltage capability is particularly important for products needing high-voltage output drivers and those requiring high SNR (signal to noise ratio). For instance, touch ICs in tablets and notebooks mainly use 20V and monitors use 30V.

So far, MagnaChip has been developing various hybrid processes with higher performance at lower costs to meet the growing market needs for diverse and multi-function foundry products. Additionally, the next version of the hybrid embedded eFlash process is already under development to extend the voltage capability to 40V. Another type of hybrid process, e-Flash with 40V BCD (Bipolar CMOS DMOS), has been widely accepted in the market. MagnaChip is also developing e-Flash with 120V BCD process to continue to pioneer new markets. These technologies have the potential for broad applications including wireless power chargers, USB type-C PDs, motor driver ICs and BLU driver ICs.

“The second generation 0.13 micron eFlash with high-voltage technology is highly desirable for products requiring both memory and high-voltage, such as wireless power charger ICs, large panel touch ICs and fingerprint ICs,” said YJ Kim, CEO of MagnaChip, “MagnaChip will continue to develop new hybrid technologies to enable our customers to design various products and to stay competitive in the market.”

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with about 40 years of operating history, owns a portfolio of approximately 3,000 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:
United States (Investor Relations):
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

USA media / industry analysts:
Mike Newsom
LouVan Communications, Inc.
Tel. +1-617-803-5385
mike@louvanpr.com

Korea / Asia media:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., Feb. 18, 2019 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today it now offers foundry customers its second generation 0.13 micron 18V high voltage process technology. The technology, which is dedicated for designing source drivers for LCD and OLED televisions, offers fewer steps, allows suitable high voltage device design rules to shrink chip size and adds a new device for DAC block design compared to the first generation process.

The source driver IC is the main driver IC in a television that controls signals and converts data from the timing controller into proper analog signals, and then transfers them to LCD or OLED panels. To support high definition for LCD and OLED panels, low power consumption and super slim designs for those panels, source driver ICs increasingly requires additional channels and rapid transmission speeds. To address these new market demands, MagnaChip’s Foundry Services Group has developed its second generation 18V high voltage process technology to improve and enhance source driver ICs in speed and integration.

This second generation process has improved 1.8V device current performance for high speed. Furthermore, it added LHL (Logic High-Voltage Logic), Vgs=18V, Vds=1.8V, device suitable for DAC (Digital to Analog Converter) block designs to the prior device list (1.8V, 9V and 18V). It enables highly integrated designs by applying the same design rules for both top and internal metals. MagnaChip has also advanced high voltage device design rules to achieve approximately a seven-percent reduction in chip size. Additionally, MagnaChip is simplifying all its platform technologies to enhance its process competitiveness. The second generation process eliminated two process steps to achieve competitive number of process steps in the industry. Moreover, it offers various option modules including MIMs, resistors, BJTs and capacitors, and designers will be able to conveniently choose from these options that suit their design needs and specifications.

MagnaChip also offers diverse high voltage from 9V to 45V processes required to produce LDDIs (Large Display Driver ICs) and MDDIs (Mobile Display Driver ICs). With expertise from more than 17 years of experience in mass production of driver ICs for laptops, tablets, monitors, TVs, smart phones and other various applications, MagnaChip continues to develop high performance and cost effective processes to strengthen its high voltage process portfolio.

“The second generation 0.13 micron 18V high voltage process technology is dedicated for high performance source driver IC for LCD and OLED TVs,” said MagnaChip CEO YJ Kim. “We will continue to improve the performance of our high voltage technology to lead the high voltage sector and help our customers stay competitive in the market.”

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of more than 3,000 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

United States (Investor Relations):
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

USA media / industry analysts:
Mike Newsom
LouVan Communications, Inc.
Tel. +1-617-803-5385
mike@louvanpr.com

Korea / Asia media:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., Dec. 20, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today it now offers foundry customers its third generation 0.18 micron Bipolar-CMOS-DMOS (BCD) process technology. The technology is highly suitable for PMIC, DC-DC converters, battery charger ICs, protection ICs, motor driver ICs, LED driver ICs and audio amplifiers. The third generation 0.18 micron BCD process technology offers improved specific on-resistance (Rsp) of power LDMOS (Laterally Diffused Metal Oxide Semiconductor) that operates up to 40V with simplified manufacturing steps.

Demand is increasing for high-performance and power-efficient Power ICs processed in BCD technology in order to reduce the number of components in power modules by having multiple functions in one chip. In BCD technologies, the Rsp characteristics of power LDMOS is a key performance parameter because BCD technology with lower Rsp LDMOS helps reduce chip size and power loss of power ICs. MagnaChip has been improving the Rsp of power LDMOS for last ten years. Now, by process and device architecture optimization, MagnaChip’s third generation 0.18 micron BCD process technology reduces the Rsp by approximately 30%, as compared to the previous generation.

BCD technology requirements vary for different applications and IC design schemes. To cover various requirements, MagnaChip adopted the modular process concept that can generate diverse combinations of 1.8V, 5V, and 12~40V transistors. In addition to the current device combinations, MagnaChip intends to release new devices in 2019, such as: tailored LDMOS devices optimized for a specific range of operational voltages and LDMOS devices with low Vgs (bias between gate to source) that are suitable for power ICs with strict operational voltage limits and other operating at high frequencies.

The third generation BCD process technology offers various optional devices to enhance design integration and flexibility. The optional devices include a high performance bipolar transistor, Zener diode, high resistance poly resistor with no additional photo layer, tantalum nitride resistor with low temperature coefficient, metal-insulator-metal capacitor, metal-oxide-metal capacitor, electrical fuse, and multi-time programmable memory.

To support power ICs for more stringent reliability requirements, as in automotive applications, this third generation BCD process technology was qualified based on the automotive grade qualification specification of AEC-Q100 with Grade1 temperature conditions between -40 to 125 °C.

YJ Kim, Chief Executive Officer of MagnaChip, commented, “Our third generation 0.18 micron BCD process technology with low specific on-resistance is highly suitable for many power IC applications because it helps reduce chip size and improve power efficiency. And we will continue to improve the performance of our BCD technology, as it will help our customers increase the competitiveness of their products.”

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of more than 3,000 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:
United States (Investor Relations):
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

USA media / industry analysts:
Mike Newsom
LouVan Communications, Inc.
Tel. +1-617-803-5385
mike@louvanpr.com

Korea / Asia media:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com