Category: Events

SEOUL, South Korea and SAN JOSE, Calif., Dec. 20, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today it now offers foundry customers its third generation 0.18 micron Bipolar-CMOS-DMOS (BCD) process technology. The technology is highly suitable for PMIC, DC-DC converters, battery charger ICs, protection ICs, motor driver ICs, LED driver ICs and audio amplifiers. The third generation 0.18 micron BCD process technology offers improved specific on-resistance (Rsp) of power LDMOS (Laterally Diffused Metal Oxide Semiconductor) that operates up to 40V with simplified manufacturing steps.

Demand is increasing for high-performance and power-efficient Power ICs processed in BCD technology in order to reduce the number of components in power modules by having multiple functions in one chip. In BCD technologies, the Rsp characteristics of power LDMOS is a key performance parameter because BCD technology with lower Rsp LDMOS helps reduce chip size and power loss of power ICs. MagnaChip has been improving the Rsp of power LDMOS for last ten years. Now, by process and device architecture optimization, MagnaChip’s third generation 0.18 micron BCD process technology reduces the Rsp by approximately 30%, as compared to the previous generation.

BCD technology requirements vary for different applications and IC design schemes. To cover various requirements, MagnaChip adopted the modular process concept that can generate diverse combinations of 1.8V, 5V, and 12~40V transistors. In addition to the current device combinations, MagnaChip intends to release new devices in 2019, such as: tailored LDMOS devices optimized for a specific range of operational voltages and LDMOS devices with low Vgs (bias between gate to source) that are suitable for power ICs with strict operational voltage limits and other operating at high frequencies.

The third generation BCD process technology offers various optional devices to enhance design integration and flexibility. The optional devices include a high performance bipolar transistor, Zener diode, high resistance poly resistor with no additional photo layer, tantalum nitride resistor with low temperature coefficient, metal-insulator-metal capacitor, metal-oxide-metal capacitor, electrical fuse, and multi-time programmable memory.

To support power ICs for more stringent reliability requirements, as in automotive applications, this third generation BCD process technology was qualified based on the automotive grade qualification specification of AEC-Q100 with Grade1 temperature conditions between -40 to 125 °C.

YJ Kim, Chief Executive Officer of MagnaChip, commented, “Our third generation 0.18 micron BCD process technology with low specific on-resistance is highly suitable for many power IC applications because it helps reduce chip size and improve power efficiency. And we will continue to improve the performance of our BCD technology, as it will help our customers increase the competitiveness of their products.”

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of more than 3,000 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:
United States (Investor Relations):
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

USA media / industry analysts:
Mike Newsom
LouVan Communications, Inc.
Tel. +1-617-803-5385
mike@louvanpr.com

Korea / Asia media:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., Nov. 12, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers Foundry customers a 0.18 micron BCD (Bipolar-CMOS-DMOS) 200V high-voltage process. This new BCD process uses SOI (Silicon On Insulator) substrates with solid high-voltage isolation and extends MagnaChip’s existing BCD processes from 100V to 200V. Having 200V devices in a BCD process is valuable because it enables a Power IC to be designed for high voltage applications, including automobiles, electrical vehicles, industrial motor drivers, ultrasonic medical imaging systems and solar panels.

Utilizing SOI substrates and MagnaChip’s proprietary deep-trench isolation technology provides advantages over the bulk silicon based BCD that include higher isolation breakdown voltage, smaller isolation size, better substrate noise immunity, latch-up immunity and high-side isolation of power blocks with insulating silicon dioxide layer between active silicon layers and substrates. In this technology, two types of power LDMOS technology (Laterally Diffused Metal Oxide Semiconductor) are supported up to 200V. The first type has low specific on-resistance (Rsp), which increases packing density of power blocks. The second type supports full ranges of SOA (safe operation area) to guarantee long-term reliability with all ranges of VDS (Drain-to-Source voltage) and VGS (Gate-to-Source voltage). Foundry customers can select either type, depending upon their circuit requirements.

Many valuable option devices are also supported in the new 0.18 micron 200V BCD process to enhance design integration and flexibility. The option devices include high performance bipolar transistors, Zener diode, Schottky diode, high resistance poly resistor, metal-insulator-metal capacitor, metal-oxide-metal capacitor, electrical fuse and multi-time programmable memory.

Certain end markets, including automotive, require that power ICs are capable of achieving high-temperature reliability and high operation voltages. This is especially the case for Electric vehicles and hybrid cars as more 48V battery systems are adopted. To meet these increased demands, MagnaChip’s new 200V BCD technology was qualified based on the automotive-grade-qualification specification of AEC-Q100 with Grade0 temperature condition between -40 to 150 °C.

YJ Kim, Chief Executive Officer of MagnaChip, commented, “We are very pleased to offer our 0.18 micron 200V BCD process solution for attractive applications including electric vehicles and solar panels.” Mr. Kim added, “Our goal is to continue to increase our power technology portfolio to meet the demanding requirements of our Foundry customers in various markets.”

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of more than 3,000 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

United States (Investor Relations):
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

USA media / industry analysts:
Mike Newsom
LouVan Communications, Inc.
Tel. +1-617-803-5385
mike@louvanpr.com

Korea / Asia media:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com

SEOUL, South Korea, SAN JOSE, Calif. and SHENZHEN, China, Sept. 24, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it will hold a Foundry Technology Symposium at the Shangri-La Shenzhen, China, on November 27, 2018. After holding a successful Foundry Technology symposium in Shenzhen, China, in 2015, this second technology symposium in Shenzhen is part of MagnaChip’s global foundry targeted geographic strategy to increase MagnaChip’s brand awareness in China.

Major topics to be discussed are MagnaChip’s current Foundry service offerings and future business roadmap, specialty technology processes, target applications and end-markets. This symposium is being conducted as a direct response to the increased interest and demand from current fabless customers in China for advanced analog and mixed-signal specialized foundry technologies.

During the symposium in Shenzhen, MagnaChip will highlight its technology portfolio along with discussions focused on mixed-signal, low-power technologies in the Internet of Things (IoT) sector, Bipolar-CMOS-DMOS (BCD) for high-performance analog and power management applications, Ultra-High Voltage (UHV) and Non-Volatile Memory (NVM). In addition, MagnaChip will present technologies used in applications including smartphones, tablet PCs, automotive, LED lighting, consumer wearables and IoT.

“We hope that this Foundry Technology Symposium in Shenzhen will better position us to understand our customers’ needs in China,” said YJ Kim, Chief Executive Officer of MagnaChip. “With our technology symposiums held in Taiwan, the United States and now in Shenzhen, China, we strongly believe that we will be able to better serve our global customers with our long history of providing successful foundry services and with our deep technological expertise.”

A multitude of fabless companies, IDMs (Integrated Device Manufacturers) and other semiconductor companies are expected to attend MagnaChip’s Shenzhen technology symposium.

To sign up for the event, and to receive more detailed information regarding the symposium, please visit www.magnachip.com or ifoundry.magnachip.com.

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,100 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com

MagnaChip to Begin Volume Production of ABOV Semiconductor MCU Applications Using 0.13 micron eFlash Ultra-Low Leakage Process

SEOUL, South Korea and SAN JOSE, Calif., Sept. 5, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today it has begun the mass production of foundry products for ABOV Semiconductor (“ABOV”) using MagnaChip’s 0.13 micron eFlash process. ABOV has previously used MagnaChip’s 0.18 micron eFlash process for volume production of various MCU (Microcontroller Units) products, and has begun migration to 0.13 micron eFlash process for its major products.

MagnaChip provides its internally developed eFlash cells and IP (Intellectual Property) to a broad range of customers and applications. The 0.18 micron eFlash process has been proven for its outstanding quality through the successful production of more than 500,000 wafers over the past decade, and its characteristics have been qualified under the automotive AEC-Q100 grade-0 150C standard. The 0.13 micron eFlash technology reduced the cell size by 26% and the IP size by 35% based on 32Kbytes as compared with the 0.18 micron eFlash technology, while also increasing net die per wafer and achieving better cell performance. With regard to IP performance, the 0.13 micron eFlash process produces faster access time and lower read current from the 0.18 micron eFlash process. In particular, the ultra-low leakage based 0.13 micron eFlash process reduces transistor leakage current, which makes it suitable to meet the specifications of low-power products.

ABOV is using MagnaChip’s 0.13 micron eFlash process for production of its 32-bit general purpose microcontrollers, with 40 MHz operation frequency and 16KB/32KB/64KB eFlash memories. The16KB/32KB products are used primarily in drone controllers and in small home appliances such as electric toothbrushes, electric shavers, water purifiers and vacuum cleaners. The 32KB/64KB microcontrollers are more suitable for larger home appliances such as washing machines, refrigerators, air conditioners and rice cookers. Additionally, ABOV is developing touch keys and grip sensors with the 0.13 micron eFlash process, and plans to develop remote controllers and next-generation 32-bit general-purpose microcontrollers, including customized MCU for IoT applications.

“I am thrilled about our new leadership in the MCU market, thanks to the ramp production of 0.13 micron eFlash products. It is another great outcome of the strategic partnership between MagnaChip and ABOV,” said Won Choi, CEO of ABOV. “We hope that the continuation of our strategic partnership with MagnaChip will be a mutually beneficial one in the long-term.”

“I am pleased that the continued joint collaboration of MagnaChip and ABOV has resulted in the successful launch of volume production of MCU products using MagnaChip’s 0.13 micron eFlash technology,” said YJ Kim, CEO of MagnaChip. “This 0.13 micron eFlash process is especially well suited for MCU products that require low-power consumption. MagnaChip intends to continue to develop high-performing and cost-efficient eFlash solutions to satisfy the increasingly diverse needs of foundry customers.”

About ABOV Semiconductor
Headquartered in South Korea, ABOV Semiconductor is a leading designer and manufacturer of microcontrollers, advanced nonvolatile memory and various semiconductor solutions. Leveraging its unique IP (Intellectual Property) portfolio, ABOV provides complete solutions focused on industrial and consumer appliances markets. ABOV’s technologies enable the capabilities and features integrated in thousands of popular product applications.

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,100 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., Aug. 6, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today it will host its annual Foundry Technology Symposium at Ambassador Hotel Hsinchu, Taiwan, on September 18th, 2018.

The Foundry Technology Symposium will showcase MagnaChip’s latest technology offerings and provide a wide-ranging overview of MagnaChip’s manufacturing capabilities, specialty technologies, target applications and end-markets. In addition, MagnaChip plans to discuss current and future semiconductor foundry business trends, and provide insights into key end markets.

At the Symposium, MagnaChip will showcase its proprietary foundry technology used by customers to help enable the design and production of:
• Mixed-Signal for audio ICs, fingerprint sensor ICs, microphone MEMS ASIC, sensor ICs, RF switch/tuner and LNA for smartphones,
tablets, and IoT devices
• BCD (Bipolar CMOS DMOS) and Hybrid (BCD integrated with Non Volatile Memory) processes for PMIC, DC-DC, PoE, USB PD,
LED driver ICs, IoT, industrial and automotive applications
• Embedded NVM for MCUs, touch ICs, auto focus ICs, security ICs and UHV (Ultra High Voltage) for LED lighting, AC-DC

Technical experts and customer-facing representatives from MagnaChip will highlight the Company’s customer-friendly design environment.

“We are pleased to host our 2018 Foundry Technology Symposium in Taiwan,” said YJ Kim, Chief Executive Officer of MagnaChip. “We will offer attendees an opportunity to better understand how our foundry offerings and specialty technologies may be used to develop high-performance products targeted to high-growth markets.”

More than 100 fabless companies, IDMs (Integrated Device Manufacturers) and other semiconductor companies are expected to attend the symposium. To register for MagnaChip’s 2018 Foundry Technology Symposium in Hsinchu, and for further details regarding the event, please visit www.magnachip.com or ifoundry.magnachip.com.

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,100 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., July 16, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers planar-type Hall-effect sensors for foundry customers.

The Hall-effect sensor has been adopted by the market for an increasing number of applications, such as smartphone cameras for the closed-loop auto focus feature and for the auto iris function, etc. Since 2014, MagnaChip has been mass-producing Hall switches and electrical compasses using the planar-type Hall-effect sensor. The Hall-effect sensor was suitable for high sensitivity and low-corner frequency, and features 50x50um2 in size. The initial products were characterized by Hall resistance of 2.4K ohms, sensitivity of 44.5mV/VT and a corner frequency of 500Hz. Most of all, it was recognized for its robustness and stability against noise. With outstanding features, the initial products were well adopted in the market and this in turn prompted MagnaChip to provide the planar-type Hall-effect sensors to its existing and potential foundry customers.

The key benefit of MagnaChip’s Hall-effect sensor is that it can be easily integrated into a customer’s design by adding only one mask to various processes that the foundry already offers. In addition, the integration of the Hall-effect sensors can be made without making any changes in electrical characteristics and it is offered regardless of the technology node, ranging from 0.13um to 0.35um. The process design kit (PDK) provides P-cell and Verilog-A model, with availability to a temperature of up to 150ºC to ensure a wider use in diverse applications, such as the fast growing IoT and automotive markets.

Furthermore, MagnaChip is developing a vertical Hall-effect sensor with the direction of the magnetic field being parallel to the silicon surface, which enables 3 dimensional Hall sensing capabilities. A vertical Hall-effect sensor can also be used in a wide range of applications, including proximity switching, positioning, speed detection and current sensing applications. MagnaChip anticipates that it will develop a variety of Hall-effect sensors to meet the growing needs of its global foundry customers.

“We are delighted to provide foundry services using the Hall-effect sensor,” said YJ Kim, Chief Executive Officer of MagnaChip. “We will continue to make efforts to meet the diverse and specialized expectations of our global foundry customers by offering customized and tailored Analog and Mixed-Signal foundry processes and services.”

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,200 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., May 14, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (MagnaChip Semiconductor) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today the availability of 0.13 micron Multiple-Time Programmable Intellectual Property (MTP-IP) memory cores targeted for mobile and industrial applications.

Jointly developed with Taiwan-based Yield Microelectronics Corporation (YMC), the non-volatile MTP-IP memory core is coupled with MagnaChip’s 0.13 micron mixed signal and BCD technologies to provide global foundry customers with system-on-a-chip performance for embedded microcontrollers capable of being programmed one thousand times.

Demand for embedded and programmable Non-Volatile Memory (NVM) is growing in diverse applications, including autofocus drivers, power management ICs (PMICs) and touch control panels. NVM technology requires zero to two mask layers less than embedded Flash memory, and has a thousand-time programming/erasing capability. As a result, MTP is gaining interest as a highly competitive and cost-effective solution over One-Time Programmable (OTP) solutions. MagnaChip and YMC already have collaborated on MTP solutions in 0.35um to 0.18um tech nodes, and mass-produced a variety of products including MCUs, touch and power management ICs (PMICs).

The new version of non-volatile MTP coupled with 0.13um mixed-signal and BCD technologies offers superior performance as compared with the previous version of our MTP. The MTP solution for 0.13um mixed-signal has achieved 0.061mm2 1Kbits IP size, and due to increasing market demand, lowered the read/write operation range to 1.65V. The dual-cell and ECC designs have greatly enhanced reliability, making them well-suited solutions for auto focus ICs and have potential for applications including Touch and Security. The MTP for 0.13um BCD technology provides high-density 16K*32 MTP + 1K EEPROM IP with ECC design and 40-nanosecond (ns) high-speed access time. The two companies plan to expand this newly developed IP portfolio to meet automotive grade-1requirements, mobile device specifications and for other diverse applications.

“The continued collaboration between MagnaChip and YMC has produced greater innovation and variety in the types of MTP solutions being offered to customers,” said Daniel Huang, YMC’s President. “YMC sees its continued strategic partnership with MagnaChip as a long-term benefit to both YMC’s and MagnaChip’s customers.”

“We are delighted to continue this valuable partnership with Taiwanese IP solution leader YMC,” said YJ Kim, Chief Executive Officer of MagnaChip. “We believe our collaboration will lead to even more cost-efficient, high-functioning NVM solutions to satisfy the increasingly sophisticated needs of global foundry customers for a growing number of diverse applications.”

About Yield Microelectronics Corporation
Yield Microelectronics Corporation (YMC), located in Taiwan’s Chu-Pei city, is a specialized embedded logic multiple-time non-volatile memory (NVM) IP provider. YMC’s innovative NVM MTP-IP products are licensed to design houses and semiconductor foundries, allowing them to integrate crucial non-volatile memory with analog and digital functionality on a single chip. YMC’s NVM IP is characterized by its competitive cell and macro size, adopts logic-based architecture and features the scalability and ease of porting for different technologies and processes such as logic, high-voltage, mixed-mode, bipolar-CMOS-DMOS and many others. For more information, please visit www.ymc.com.tw.

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,200 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., April 16, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it will host its Annual U.S. Foundry Technology Symposium at Hilton Santa Clara, California, on May 23rd, 2018.

The primary purpose of the Foundry Technology Symposium is to showcase MagnaChip’s latest technology offerings and provide an in-depth understanding of MagnaChip’s manufacturing capabilities, its specialty technology processes, target applications and end-markets. During the symposium, MagnaChip plans to discuss current and future semiconductor foundry business trends, and also cover presentations in key markets with guest speakers.

While providing an in-depth overview of its specialty processes, MagnaChip will also highlight its technology portfolio and future roadmap, including technologies such as mixed-signal, which supports applications in the Internet of Things (IoT) and RF switch sector and Bipolar-CMOS-DMOS (BCD) for high-performance analog and power management applications. In addition, MagnaChip will also feature applications regarding Ultra-High Voltage (UHV), such as LED lighting and AC-DC chargers, and cover Non-Volatile Memory (NVM)-related technologies, such as Touch IC, Automotive MCUs and other customer-specific applications. MagnaChip will present its technologies used in applications including smartphones, tablet PCs, automotive, industrial, LED lighting and the wearables segments. MagnaChip will also review its customer-friendly design environment and an on-line customer service tool known as “iFoundry.”

“We are very pleased to host MagnaChip’s Annual Foundry Technology Symposium in the U.S. again this year,” said YJ Kim, Chief Executive Officer of MagnaChip. “We plan to offer participants an opportunity to better understand MagnaChip’s specialty process technologies and customer service offerings.” MagnaChip has approximately 497 proprietary process flows to offer its foundry customers.

More than 100 fabless companies, IDMs (Integrated Device Manufacturers) and other semiconductor companies are expected to attend the event. To sign up for MagnaChip’s Annual Foundry Technology Symposium in Santa Clara and for more details regarding the symposium, please visit www.magnachip.com or ifoundry.magnachip.com.

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,200 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., March 19, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers a 0.18 micron BCD (Bipolar-CMOS-DMOS) 100V high voltage process. The features of this new BCD process compare favorably with previous generations of process technology.

The new BCD process requires three fewer layers of photo steps by process optimization, and has low specific on-resistance (Rsp) of power LDMOS (Laterally Diffused Metal Oxide Semiconductor) up to 100V. Having 100V devices in BCD process is valuable as there are increasing demands to expand operation voltages and protection voltages to 100V in many applications, such as Power over Ethernet (PoE), AC-DC chargers, solar panel power ICs, and automotive battery systems. In addition, the new BCD process offers automotive-grade reliability for DC-DC converters, LED drivers, motor drivers, battery chargers, and PMICs used in automotive electronics.

In power ICs that use BCD technologies, the area of power transistors like LDMOS occupies major chip area. And the specific on-resistance of power transistors — which is defined as the product of total on-resistance and area of the device when a transistor is turned on — is the key factor that determines overall chip area. As a specialty analog foundry, MagnaChip has improved the specific on-resistance over the past 10 years to assist foundry customers achieve smaller chip sizes and reduce costs. Utilizing MagnaChip’s proprietary deep-trench isolation technology and advanced device designs, the low specific on-resistance of 100V operation LDMOS was achieved on conventional silicon substrates without the use of more expensive SOI (Silicon-On-Insulator) substrates. Overall, with these process advantages, this new 0.18 micron BCD 100V high voltage process can enhance cost effectiveness of customers’ products.

To support power ICs for various applications like consumer, industrial, and especially automotive applications, this process technology was qualified based on the automotive-grade-qualification specification of AEC-Q100 with Grade1 temperature condition between -40 to 125 °C.

There are option devices in the new 0.18 micron BCD process to enhance design integration and flexibility. The option devices include a high performance bipolar transistor, high resistance poly resistor, tantalum nitride resistor with low temperature coefficient, metal-insulator-metal capacitor, metal-oxide-metal capacitor, electrical fuse, and multi-time programmable memory.

YJ Kim, Chief Executive Officer of MagnaChip, commented, “We are very pleased to offer our 0.18 micron BCD 100V process solution that combines both the advantages of high-performance as well as high reliability.” Mr. Kim added, “Our goal is to continue to develop technologies with high performance and high reliability to cover a broad range of applications for our foundry customers”.

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,200 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., Feb. 12, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, announced today it now offers the 2nd generation of 0.13 micron BCD process technology integrated with high-density embedded Flash memory. This second-generation BCD process offers advanced features compared to previous BCD processes, which are high-density Flash memory up to 64 kilo bytes, low specific Ron of power LDMOS up to 40V, low number of photo steps and automotive grade reliability. These characteristics make the new generation of BCD process technology highly suitable for programmable PMICs, wireless power chargers, USB-C power-delivery IC products and automotive power ICs.

Traditionally, the non-volatile memories in the BCD process are low in density, below 256 bytes, for trimming purposes. However, today’s electronic devices require more complex functions and lower power consumption. As a result, there is a greater market need for high-density embedded non-volatile memory in the BCD process. This memory includes Flash memory used for power ICs, including programmable PMICs, wireless power chargers and USB-C power-delivery ICs. In some applications, high-density Flash memory up to 64 kilo bytes is used to store programming codes as well as trimming data. Until now, the drawback of implementing high-density embedded memory in other BCD processes has been that it increases the overall number of manufacturing steps.

MagnaChip was able to eliminate 8 photo steps in the second-generation BCD process from the 1st generation by process optimization. Aside from embedded non-volatile memory, the 2nd generation also achieved the improvement of power LDMOS specific Ron performance, which is well suited for high-power requirements up to 40V operation. For IoT and automotive applications, this BCD process provides 1.5V and 5V CMOS devices with very low leakage current level that enables low power consumption. Furthermore, this new BCD process has various option devices for Hall sensors, varactors, inductors, and RF CMOS devices that are useful for highly integrated IC solutions, which give smaller system size and less system cost.

YJ Kim, Chief Executive Officer of MagnaChip, commented, “The integration of analog-based BCD and high density non-volatile memory enables highly suitable ICs and system designs for power management solutions, wireless chargers and power ICs used in smartphones, IoT devices and automotive applications.” Mr. Kim added, “Our goal is to continue to develop specialized and innovative process technologies that meet the changing market requirements of our foundry customers.”

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,200 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com