Camillo Martino to Continue as Chairman of the Board

SEOUL, South Korea–(BUSINESS WIRE)–Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) announced the appointment of Chae Lee as Chief Executive Officer, effective July 1, 2026. Lee is also expected to join Magnachip’s Board of Directors following the effective date of his appointment. Lee succeeds Camillo Martino, who has served as Interim Chief Executive Officer since August 2025 and will continue to serve as Chairman of the Board of Directors.

Lee brings more than 30 years of global semiconductor industry experience spanning power semiconductors, power management integrated circuits (PMIC), sensors, audio amplifiers with expertise in applications, sales, marketing, operations and executive leadership. Most recently, he served as Chief Executive Officer of Tagore Technology, a provider of Gallium Nitride (GaN) semiconductor solutions for Radio Frequency (RF) and Power applications. Prior to Tagore, Lee held senior leadership positions at semiconductor companies including Insyte Systems, NXP Semiconductors, and Maxim Integrated Products where he was responsible for strong high-margin revenue growth through innovative product development in its mobility group.

“Chae has a strong background ideally suited to guide Magnachip through its next phase of growth,” said Camillo Martino, Chairman of the Board. “Chae brings a unique combination of deep technical expertise, operational leadership and commercial experience across both power ICs and system solutions. His experience aligns perfectly with Magnachip’s strategy to strengthen our product portfolio, accelerate innovation and expand our presence in high-value power semiconductor markets.”

Martino added, “On behalf of the Board, I would also like to thank our employees for their dedication and resilience over the past year. I look forward to continuing to work closely with Chae and the management team as Chairman.”

“I am honored to join Magnachip at this important point in its evolution,” said Lee. “Magnachip has a strong heritage in power semiconductors, a talented team, valuable manufacturing assets and on a path to developing compelling next-generation products. I believe the Company is well positioned to capitalize on long-term opportunities across AI, data center, industrial, automotive, robotics, communications, computing and consumer applications. I look forward to working closely with the Board and the entire Magnachip organization to build on the progress already underway and create outstanding value for customers, employees and shareholders.”

About Magnachip Semiconductor

Magnachip is a designer and manufacturer of analog and mixed-signal power semiconductor platform solutions for various applications, including industrial, automotive, communication, consumer and computing. The Company provides a broad range of standard products to customers worldwide. Magnachip, with about 45 years of operating history, owns a substantial number of registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through Magnachip’s website is not a part of, and is not incorporated into, this release.

Contact:

Mike Bishop

United States (Investor Relations)

Bishop IR, LLC

Tel. +1-415-891-9633

mike@bishopir.com

Kyeongah Cho

Global Marketing Communication

Magnachip Semiconductor

Tel. +82-2-6903-3179

pr@magnachip.com

– Designed for High-Efficiency Power Systems in AI Servers, EV Chargers and Industrial Applications

– Low R_DS(ON),Fast Recovery Body Diode and Integrated Zener Diode for Enhanced Performance and Reliability

SEOUL, South Korea – Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) today announced the introduction of two new 6th-generation 600V Super Junction (SJ) MOSFETs designed to meet the growing performance and efficiency requirements of AI server power applications.

The new products feature low R_DS(ON) values of 36mΩ and 37mΩ, helping reduce conduction losses and improve overall power conversion efficiency. In addition, both devices integrate a Zener diode between the gate and source terminals to provide enhanced protection against electrostatic discharge (ESD), thereby improving device reliability. The chip size has also been significantly reduced compared with the previous generation, contributing to improved integration and design flexibility.

The MMTB60R037G6FZVRH incorporates a Fast Recovery Body Diode, which helps reduce reverse recovery losses and improve switching performance in high-frequency power conversion systems. These characteristics make it well suited for AI server power supplies, where efficiency, thermal management, and power density are critical design considerations.

Both devices are offered in a TOLL package and are designed for high-power, high-current applications. They also feature a Kelvin Source configuration, which reduces parasitic inductance and improves switching stability.

The growing demand for energy-efficient power conversion solutions across AI servers, EV charging systems and industrial power supplies is driving the adoption of advanced power semiconductors. Higher efficiency, improved thermal performance and increased power density have become critical requirements for next-generation power systems.

According to Omdia, the discrete semiconductor market within computing & data storage applications is projected to grow from approximately $3.7 billion in 2025 to approximately $5.9 billion by 2030, representing a compound annual growth rate (CAGR) of approximately 9%. The growing adoption of high-density, high-efficiency server power architectures is expected to further drive demand for power discrete devices, including SJ MOSFETs.

“As demand continues to grow for more efficient and reliable power systems across AI infrastructure, EV charging systems and industrial applications, power semiconductor performance becomes increasingly important,” said Hyuk Woo, Chief Technology Officer of Magnachip. “Our new 6th-generation 600V SJ MOSFETs combine low on-resistance, enhanced switching characteristics and robust reliability features to help customers improve efficiency and power density in next-generation power designs.”

The new SJ MOSFETs are also suitable for a wide range of power applications requiring high efficiency and reliability, including industrial power supplies, telecom infrastructure, and EV charging systems.

Related Links

Power Solutions > SJ MOSFETs > 600V

Related Articles

Magnachip Launches 650V Super Junction TOLL Package Products with Integrated Kelvin Source

About Magnachip Semiconductor

Contact:

Mike Bishop

United States (Investor Relations)

Bishop IR, LLC

Tel. +1-415-891-9633

mike@bishopir.com

Kyeongah Cho

Global Marketing Communication

Magnachip Semiconductor

Tel. +82-2-6903-3179

pr@magnachip.com

In the Media

Magnachip Launches New 6th-Generation 600V SJ MOSFETs for AI Servers and EV Charging Applications

– High-efficiency, high-power-density MV MOSFET solutions for AI servers, data centers, high-performance computing (HPC) and industrial power systems

– Comprehensive power semiconductor portfolio on display, including LV MOSFETs, MV MOSFETs, SJ MOSFETs, IGBTs, SiC, and Power ICs

– PCIM Europe 2026, Nuremberg, Germany — Hall 6, Booth 337

Seoul, South Korea, May 26, 2026 — Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”), a designer and manufacturer of power semiconductor solutions, today announced that it will showcase its Medium-Voltage (MV) MOSFET portfolio for AI server and data center power systems at PCIM Europe 2026, which will be held from June 9 to 11, 2026, in Nuremberg, Germany.

At Hall 6, Booth 337, Magnachip will exhibit its MV MOSFET solutions for server and data center power supply units (PSUs), high-performance computing (HPC), and industrial power systems.

As AI workloads continue to expand and data center power consumption rises, power efficiency, power density, and thermal management have become increasingly important in server and data center power system design. According to market research firm Omdia, the global power discrete semiconductor market for Computing and Data Storage applications is expected to grow from approximately $2.3 billion in 2025 to $3.0 billion in 2029, representing a compound annual growth rate (CAGR) of approximately 7.4%.

At the exhibition, Magnachip will highlight its MV MOSFET portfolio designed to support high-efficiency and high-density power architectures for AI servers and data centers.

MV MOSFET Solutions for AI Servers and Data Centers

Magnachip’s MV MOSFET product family is designed for a broad range of applications including synchronous rectification stages in server and high-performance computing power supply systems, industrial power systems, and solar inverter applications. Based on advanced Shielded-Gate Trench (SGT) technology, the portfolio is designed to support improved current density and switching performance while addressing the requirements of high-temperature and high-density power designs.

“As power demand in AI servers and data centers continues to increase, customers are seeking semiconductor solutions that can support higher power efficiency and power density. Magnachip plans to continue expanding its MV MOSFET portfolio and strengthening its power semiconductor solutions for AI servers, data center power systems, and industrial applications.”

— Hyuk Woo, Chief Technology Officer, Magnachip Semiconductor

Broader Power Semiconductor Portfolio

In addition to its MV MOSFET solutions, Magnachip will also showcase its broader power semiconductor portfolio spanning LV MOSFETs, MV MOSFETs, Super Junction MOSFETs, IGBTs, SiC, and Power ICs. These products support a broad range of automotive and industrial applications, including:

∙ EV & Automotive — traction inverters, onboard chargers (OBC), and DC-DC converters

∙ Industrial — solar, ESS, motor control, and industrial automation

PCIM Europe 2026 Exhibition Information

Magnachip will participate in PCIM Europe 2026 (Hall 6, Booth 337) in Nuremberg, Germany, where it will showcase its MV MOSFET portfolio for AI servers and data centers, along with its broader power semiconductor solutions portfolio.

∙ Location: Hall 6, Booth 337 — Nuremberg, Germany

∙ Date: June 9–11, 2026

∙ See Floorplan: PCIM – Magnachip

∙ Meeting Request: kyeongah.cho@magnachip.com

∙ More Information: Magnachip at PCIM Europe 2026

About Magnachip Semiconductor

Contacts:

Mike Bishop

United States (Investor Relations)

Bishop IR, LLC

Tel. +1-415-891-9633

mike@bishopir.com

Kyeongah Cho

Global Marketing Communication

Magnachip Semiconductor

Tel. +82-2-6903-3179

pr@magnachip.com

In the Media

Magnachip to Showcase MV MOSFET Portfolio for AI Servers and Data Centers Alongside Its Broader Power Semiconductor Portfolio at PCIM Europe 2026

Magnachip Reports Results for First Quarter 2026

Apr 28, 2026

Q1 Results Summary

Consolidated revenue from continuing operations (which includes Power Analog Solutions (“PAS”) and Power IC (“PIC”) businesses) was $46.2 million, approximately at the mid-point of our guidance range of $44.0 to $48.0 million.
Revenue grew by 3.3% year over year and 13.9% quarter over quarter.
Consolidated gross profit margin from continuing operations of 15.6% was above the mid-point of our guidance range of 14.0% to 16.0%.

Recent Highlights

Launched 8th-generation ultra low-Rss(on) 12V BatteryFET designed for smartphone battery power efficiency
Launched 8th-generation 40V and 60V MV MOSFETs for servers and high-performance PCs
On track to launch 55 new-generation products in 2026

SEOUL, South Korea–(BUSINESS WIRE)–Apr. 28, 2026– Magnachip Semiconductor Corporation (NYSE: MX) (“Magnachip” or the “Company”) today announced financial results for the first quarter 2026.

Camillo Martino, Magnachip’s CEO said, “We delivered better-than-seasonal revenue growth in the quarter, reflecting both solid execution and also the impact of the previously communicated inventory and channel actions. We are comfortable with our progress toward our multi-year transformation, and we are showing some good early signs, particularly with the 55 new-generation products launched in 2025. Our focus remains on improving product competitiveness through an accelerated pace of new-generation product launches, which we believe will drive sustainable revenue growth, margin expansion, and improved utilization over time. We believe disciplined execution of our six-pillar strategy will deliver long-term shareholder value.”

Shinyoung Park, Magnachip’s CFO, commented, “We remain committed to financial discipline to significantly improve our financial performance during this multi-year transformation.”

Q1 2026 Financial Highlights

GAAP Results

In thousands of U.S. dollars, except share data

	Q1 2026	Q4 2025	Q/Q Change	Q1 2025	Y/Y Change
Net Sales	46,208	40,570	up 13.9%	44,722	up 3.3%
Power Analog Solutions	41,647	36,811	up 13.1%	39,857	up 4.5%
Power IC	4,561	3,759	up 21.3%	4,865	down 6.2%
Gross Profit Margin	15.6%	9.3%	up 6.3%pts	20.9%	down 5.3%pts
Power Analog Solutions	12.8%	6.5%	up 6.3%pts	17.8%	down 5.0%pts
Power IC	40.4%	36.7%	up 3.7%pts	46.5%	down 6.1%pts
Operating Loss	(7,170)	(12,446)	up 42.4%	(5,278)	down 35.8%
Loss from Continuing Operations	(4,697)	(8,792)	up 46.6%	(4,051)	down 15.9%
Basic Loss per Common Share	(0.13)	(0.24)	up 45.8%	(0.11)	down 18.2%
Diluted Loss per Common Share	(0.13)	(0.24)	up 45.8%	(0.11)	down 18.2%

Non-GAAP Results

In thousands of U.S. dollars, except share data

	Q1 2026	Q4 2025	Q/Q Change	Q1 2025	Y/Y Change
Adjusted Operating Loss	(6,527)	(11,881)	up 45.1%	(4,410)	down 48.0%
Adjusted EBITDA	(3,640)	(8,856)	up 58.9%	(1,205)	down 202.1%
Adjusted Loss	(4,073)	(2,714)	down 50.1%	(2,784)	down 46.3%
Adjusted Loss per Common Share—Diluted	(0.11)	(0.08)	down 37.5%	(0.08)	down 37.5%

(1) Management believes that non-GAAP financial measures, when viewed in conjunction with GAAP results, can provide a meaningful understanding of the factors and trends affecting our business and operations and assist in evaluating our core operating performance. However, such non-GAAP financial measures have limitations and should not be considered as a substitute for net loss or as a better indicator of our operating performance than measures that are presented in accordance with GAAP. A reconciliation of historical GAAP results to non-GAAP results is included in this press release.

Q2 2026 Financial Guidance

While actual results may vary, Magnachip currently expects the following:

Consolidated revenue from continuing operations (which includes Power Analog Solutions and Power IC businesses) to be in the range of $44.5 million to $48.5 million, roughly flat sequentially and a decrease of 2.3% year-over-year at the mid-point. This compares with $46.2 million in Q1 2026 and $47.6 million in Q2 2025.
Consolidated gross profit margin from continuing operations to be in the range of 17% to 19%, up from 15.6% in Q1 2026 but down from 20.4% in Q2 2025.

Q1 2026 Earnings Conference Call

Magnachip will host a corresponding conference call at 2:00 p.m. PT / 5:00 p.m. ET on Tuesday, April 28, 2026, to discuss its financial results. In advance of the conference call, all participants must use the following link to complete the online registration process. Upon registering, each participant will receive access details for this event including the dial-in numbers, a PIN number, and an e-mail with detailed instructions to join the conference call. A live and archived webcast of the conference call and a copy of the earnings release will be accessible from the ‘Investors’ section of the Company’s website at www.magnachip.com.

Online registration: https://register-conf.media-server.com/register/BId9ff896cba6d4bf6bc5204e0fd2d7a6b

Consolidated Statements of Operations

In thousands of U.S. dollars, except share data (Unaudited)

	Three Months Ended March 31, 2026	Three Months Ended December 31, 2025	Three Months Ended March 31, 2025
Net sales	$46,208	$40,570	$44,722
Cost of sales	39,014	36,792	35,360
Gross profit	7,194	3,778	9,362
Gross profit as a % of net sales	15.6%	9.3%	20.9%
Operating expenses:
Selling, general and administrative expenses	7,666	8,625	9,203
Research and development expenses	6,698	7,599	5,437
Total operating expenses	14,364	16,224	14,640
Operating loss	(7,170)	(12,446)	(5,278)
Interest income	1,063	1,246	1,540
Interest expense	(373)	(393)	(423)
Foreign currency loss, net	(115)	(6,393)	(405)
Other income (loss), net	(10)	14	114
Loss from continuing operations before income tax benefit, net	(6,605)	(17,972)	(4,452)
Income tax benefit, net	(1,908)	(9,180)	(401)
Loss from continuing operations	(4,697)	(8,792)	(4,051)
Income (Loss) from discontinued operations, net of tax	50	713	(4,827)
Net loss	$(4,647)	$(8,079)	$(8,878)
Basic earnings (loss) per common share:
Continuing operations	$(0.13)	$(0.24)	$(0.11)
Discontinuing operations	0.00	0.02	(0.13)
Total	$(0.13)	$(0.22)	$(0.24)
Diluted earnings (loss) per common share:
Continuing operations	$(0.13)	$(0.24)	$(0.11)
Discontinuing operations	0.00	0.02	(0.13)
Total	$(0.13)	$(0.22)	$(0.24)
Weighted average number of shares:
Basic	36,407,581	35,979,697	36,887,841
Diluted	36,407,581	35,979,697	36,887,841

Consolidated Balance Sheets

In thousands of U.S. dollars, except share data (Unaudited)

	March 31, 2026	December 31, 2025
Assets
Current assets
Cash and cash equivalents	$94,554	$103,756
Accounts receivable, net	24,176	26,022
Inventories, net	32,848	34,151
Other receivables	4,203	2,882
Prepaid expenses	5,591	5,062
Hedge collateral	4,970	1,200
Other current assets	3,681	3,782
Total current assets	170,023	176,855
Property, plant and equipment, net	95,072	100,204
Operating lease right-of-use assets	1,797	2,070
Intangible assets, net	404	454
Long-term prepaid expenses	531	584
Deferred income taxes	61,222	64,248
Other non-current assets	6,416	7,114
Total assets	$335,465	$351,529
Liabilities and Stockholders’ Equity
Current liabilities
Accounts payable	$21,330	$20,848
Other accounts payable	10,813	11,444
Accrued expenses	5,490	6,929
Accrued income taxes	45	81
Operating lease liabilities	1,344	1,427
Current portion of long-term borrowings	26,431	—
Other current liabilities	6,264	2,681
Total current liabilities	71,717	43,410
Long-term borrowings	15,855	44,599
Accrued severance benefits, net	11,660	11,502
Non-current operating lease liabilities	509	690
Other non-current liabilities	2,921	3,078
Total liabilities	102,662	103,279
Stockholders’ equity
Common stock ($0.01 par value; 150,000,000 shares authorized; 58,249,450 issued / 36,440,854 outstanding at Mar 31, 2026; 58,027,696 issued / 36,219,100 outstanding at Dec 31, 2025)	581	579
Additional paid-in capital	282,178	281,537
Retained earnings	210,205	214,852
Treasury stock (21,808,596 shares)	(229,910)	(229,910)
Accumulated other comprehensive loss	(30,251)	(18,808)
Total stockholders’ equity	232,803	248,250
Total liabilities and stockholders’ equity	$335,465	$351,529

Consolidated Statements of Cash Flows

In thousands of U.S. dollars (Unaudited)

	Three Months Ended March 31, 2026	Three Months Ended March 31, 2025
Cash flows from operating activities
Net loss	$(4,647)	$(8,878)
Depreciation and amortization	2,882	3,273
Provision for severance benefits	1,212	1,514
Loss (gain) on foreign currency, net	4,262	(35)
Provision (reversal) for inventory reserves	(321)	1,208
Stock-based compensation	643	1,030
Deferred income tax assets	8	(415)
Others, net	74	225
Accounts receivable, net	1,611	635
Inventories	(191)	(3,259)
Other receivables	(1,547)	(811)
Prepaid expenses	(152)	1,233
Other current assets	(1,725)	970
Accounts payable	571	2,542
Other accounts payable	(254)	(2,622)
Accrued expenses	(1,068)	(111)
Accrued income taxes	(33)	(6)
Other current liabilities	593	(901)
Other non-current liabilities	53	354
Payment of severance benefits	(228)	(325)
Others, net	(187)	(290)
Net cash provided by (used in) operating activities	1,556	(4,669)
Cash flows from investing activities
Payment of hedge collateral	(3,785)	—
Proceeds from disposal of plant, property and equipment	49	—
Purchase of property, plant and equipment	(3,915)	(208)
Payment for intellectual property registration	(24)	(63)
Collection of guarantee deposits	1,891	21
Payment of guarantee deposits	(158)	(139)
Net cash used in investing activities	(5,942)	(389)
Cash flows from financing activities
Acquisition of treasury stock	(176)	(1,306)
Repayment of financing related to water treatment facility arrangement	(110)	(111)
Repayment of principal portion of finance lease liabilities	(34)	(38)
Net cash used in financing activities	(320)	(1,455)
Effect of exchange rates on cash and cash equivalents	(4,496)	557
Net decrease in cash and cash equivalents	(9,202)	(5,956)
Beginning of the period	103,756	138,610
End of the period	$94,554	$132,654

Reconciliation of Operating Loss to Adjusted Operating Loss (Continuing Operations)

In thousands of U.S. dollars (Unaudited)

	Q1 2026	Q4 2025	Q1 2025
Operating loss	$(7,170)	$(12,446)	$(5,278)
Equity-based compensation expense	643	565	868
Adjusted Operating Loss	$(6,527)	$(11,881)	$(4,410)

Reconciliation of Loss from Continuing Operations to Adjusted EBITDA and Adjusted Loss

In thousands of U.S. dollars, except share data (Unaudited)

	Q1 2026	Q4 2025	Q1 2025
Loss from continuing operations	$(4,697)	$(8,792)	$(4,051)
Interest income	(1,063)	(1,246)	(1,540)
Interest expense	373	393	423
Income tax benefit, net	(1,908)	(9,180)	(401)
Depreciation and amortization	2,877	3,019	3,120
EBITDA – continuing operations	(4,418)	(15,806)	(2,449)
Equity-based compensation expense	643	565	868
Foreign currency loss, net	115	6,393	405
Derivative valuation loss (gain), net	20	(8)	(29)
Adjusted EBITDA – continuing operations	$(3,640)	$(8,856)	$(1,205)
Loss from continuing operations	$(4,697)	$(8,792)	$(4,051)
Equity-based compensation expense	643	565	868
Foreign currency loss, net	115	6,393	405
Derivative valuation loss (gain), item net	20	(8)	(29)
Income tax effect on non-GAAP adjustments	(154)	(872)	23
Adjusted Loss – continuing operations	$(4,073)	$(2,714)	$(2,784)
Basic Adjusted Loss per share	$(0.11)	$(0.08)	$(0.08)
Diluted Adjusted Loss per share	$(0.11)	$(0.08)	$(0.08)
Weighted avg shares – basic	36,407,581	35,979,697	36,887,841
Weighted avg shares – diluted	36,407,581	35,979,697	36,887,841

Safe Harbor for Forward-Looking Statements

About Magnachip Semiconductor

Investor Contact:
Mike Bishop
Bishop IR, LLC
Tel. +1 (415) 891-9633
mike@bishopir.com

Source: Magnachip Semiconductor Corporation

– R_{SS(on) Typ.}below 1mΩ — delivering ultra-low on-resistance for battery protection circuits (PCMs)

– 48% reduction in specific on-resistance (Rsp) and 185% improvement in current density compared to the previous generation

– Designed to meet next-generation smartphone requirements for ultra-fast charging and high-efficiency battery protection

SEOUL, South Korea, April 2026 — Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) today announced the launch of two new 8th-generation Ultra Low-Ron 12V low-voltage (LV) MOSFETs designed for high-performance smartphone battery protection circuits (PCMs). These new products target next-generation smartphones, where ultra-fast charging and energy efficiency are increasingly critical, and represent an expansion of Magnachip’s product lineup, strengthening its competitiveness in the mobile battery protection FET market. One of them is in mass production and is currently being supplied to a major global smartphone manufacturer, having demonstrated proven performance and reliability.

As smartphones incorporate advanced AI functionalities and increasingly high-performance applications, computational loads are rising, driving the importance of power efficiency and charging performance. As a result, MOSFETs used in battery protection circuits (PCMs) are required to deliver low on-resistance, high current density, and efficient performance within limited board space. In addition, the growing adoption of innovative form factors such as foldable and rollable devices further constrains circuit design space, increasing the importance of enhancing performance within the same footprint while reducing component count.

The new products are designed as main switching devices in smartphone battery protection circuits (PCMs), performing critical functions such as overcharge and over-discharge protection, as well as charge and discharge current control. They offer two key advantages:

First, by significantly reducing on-resistance within the same package size, the products minimize heat generation. For example, the MDWC12D013PERH achieves more than a 50% improvement in on-resistance (R_ss(on)) compared to Magnachip’s 7th-generation device of the same size, resulting in a temperature reduction of up to 10°C under identical test conditions. This reduced heat contributes to extended battery life and improved charging stability in smartphones.

Second, enhanced current density and pin-to-pin compatibility enable replacement and integration within existing circuit designs, reducing PCB footprint and the number of FETs required, which helps reduce production costs. This allows manufacturers to utilize the saved space for larger battery capacity or slimmer device designs.

The new products incorporate Magnachip’s 8th-generation technology, utilizing a high-density trench cell structure. They reduce specific on-resistance (Rsp) by approximately 48% and improve current density by approximately 185% compared to the previous generation, achieving R_{SS(on) Typ.} below 1mΩ.

According to Omdia, generative AI has emerged as a key trend in the technology market and is rapidly expanding, driven by the consumer (digital) segment. The market is projected to grow from approximately $7.7 billion in 2022 to $30.4 billion by 2028, with smartphones expected to account for a major share of applications.

In response to these market trends, Magnachip plans to introduce 22V Ultra Low-Ron products within the year, further expanding its LV MOSFET portfolio for high-performance mobile devices.

“Achieving low on-resistance and superior thermal performance within limited space is a key challenge in smartphone battery protection circuit design. Our 8th-generation Ultra Low-Ron 12V LV MOSFET is designed to address these requirements, delivering enhanced efficiency and reliability, and is expected to provide highly competitive technical value in this application. Leveraging our expertise in power semiconductor design and manufacturing, Magnachip will continue to enhance its product competitiveness across a wide range of applications, including mobile,” said Hyuk Woo, CTO of Magnachip Semiconductor.

At PCIM Europe 2026 in Nuremberg, Germany (Hall 6, Booth 337), Magnachip will showcase its power semiconductor solutions, including these new products.

Related Links

Power Solutions > MXT MOSFETs > 12V

Related Articles

Magnachip Unveils Its First 8th-Generation MXT LV MOSFET Designed with Super-Short Channel FET II
Magnachip Launches New 24V BatteryFET for Tri-Fold Smartphone Battery Protection

About Magnachip Semiconductor

Contacts:

Mike Bishop

United States (Investor Relations)

Bishop IR, LLC

Tel. +1-415-891-9633

mike@bishopir.com

Kyeongah Cho

Global Marketing Communication

Magnachip Semiconductor

Tel. +82-2-6903-3179

pr@magnachip.com

In the Media

Magnachip Launches 8th-generation Ultra Low-Rss(on) 12V BatteryFET Designed for Smartphone Battery Power Efficiency

– Advanced Shielded-Gate Trench (SGT) Technology Simultaneously Improves Current Density and Switching Speed

– Targeting the Next-Generation Power Supply Market with High-Temperature Reliability and Energy Efficiency Requirements

SEOUL, South Korea, Mar 2026 – Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) today announced the launch of its new 8th-generation 40V and 60V Medium-Voltage (MV) MOSFETs, designed for server and high-performance PC power supply units.

As power demand in the global server and data center market increases, power efficiency and power density have emerged as important factors for power semiconductor solutions used in servers and data center applications. With these new 8th-generation MV MOSFETs, Magnachip expands its solution offerings to simultaneously meet customers’ efficiency and reliability requirements in the fast-growing server and high-performance computing (HPC) power supply market, further reinforcing its competitiveness in high-value-added power solutions.

These new products are designed for use in the Synchronous Rectification (SR) stage of server and PC power systems. Incorporating Advanced SGT technology, the 40V products deliver up to 40% improvement in current density and approximately 25% faster switching speed compared to the previous generation, while the 60V products achieve up to 50% improvement in current density and 60% faster switching speed. In addition, fast anti-parallel diode technology is applied to rapidly dissipate residual current generated during switching, which can enhance overall system stability. The devices support a wide operating temperature range of up to 175°C, which enables stable performance even in high-temperature environments, and adopt a compact PDFN56 package to facilitate high-density and compact power designs. Built to meet JEDEC standards, these MOSFETs are designed for use not only in server and high-performance PC power supply units, but also in solar inverters and industrial power systems where high efficiency and reliability are important.

Following the launch of the 0.7mΩ 40V product in May 2025, Magnachip is further strengthening its 8th-generation MV MOSFET portfolio with diverse voltage and R_DS(on)options by introducing three additional products: 0.8mΩ 40V, 1.0mΩ 40V, and 1.05mΩ 60V devices. According to global market research firm Omdia, the global server and data center power supply market (Computing and Data Storage) is projected to grow from approximately $2.3 billion in 2025 to $3.0 billion in 2029, representing a compound annual growth rate (CAGR) of 7.4%. Through this expanded product lineup, Magnachip aims to further strengthen its technological competitiveness and market share in the rapidly growing power semiconductor market.

“These new products are expected to serve as a solution that can enhance both efficiency and reliability in server and high-performance PC power systems,” said Hyuk Woo, Chief Technology Officer of Magnachip. “Leveraging our accumulated power semiconductor design expertise and proven manufacturing capabilities, Magnachip will continue to introduce high-value-added power solutions across server, PC, and industrial applications.”

At PCIM Europe 2026 in Nuremberg, Germany (Hall 6, Booth 337), Magnachip will present its latest MV MOSFET solutions, highlighting their role in enabling high-efficiency and high-density power systems.

Related Links

Power Solutions > MXT MOSFETs > 40V

Power Solutions > MXT MOSFETs > 60V

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About Magnachip Semiconductor

CONTACTS:

Mike Bishop

United States (Investor Relations)

Bishop IR, LLC

Tel. +1-415-891-9633

mike@bishopir.com

Kyeongah Cho

Global Marketing Communication

Magnachip Semiconductor

Tel. +82-2-6903-3179

pr@magnachip.com

In the Media

Magnachip Launches 8th-Generation 40V and 60V MV MOSFETs for Servers and High-Performance PCs

Across AI data centers, automotive and industrial power systems, the demand for higher power efficiency and system reliability continues to grow.

At PCIM Europe 2026, these trends were key topics across the show floor.

Magnachip introduced its power semiconductor solutions designed to support high-efficiency power conversion and exchanged insights with customers and partners across a wide range of applications. Magnachip will continue to contribute to more efficient and reliable power systems through its power semiconductor solutions.

Thank you to all customers and partners who visited Magnachip at PCIM Europe 2026.

We look forward to seeing you again in 2027.

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Q4 Results Summary

Consolidated revenue from continuing operations (which includes Power Analog Solutions (“PAS”) and Power IC (“PIC”) businesses) was $40.6 million, approximately at the mid-point of our guidance range of $38.5 to $42.5 million.
Consolidated gross profit margin from continuing operations was 9.3%, slightly above the mid-point of our guidance range of 8.0% to 10.0%.
Product revenue from our Communications business grew 24% sequentially and 68% year-over-year.

Q4 Highlights

Launched 24 new-generation products in the fourth quarter.

2025 Highlights

Launched 55 new-generation products in 2025, compared with four for the full year 2024.
Signed a strategic agreement to expand our industrial business based on a jointly developed IGBT technology with Hyundai Mobis.
Executed multiple operating expense cost reduction programs, including a headcount reduction program, expected to generate more than $2 million in annualized savings beginning in Q4 2025.
$21.4 million was spent in 2025 for the Gumi fab upgrade, of which $17.0 million was funded through equipment financing loans.

SEOUL, South Korea–(BUSINESS WIRE)–Mar. 4, 2026– Magnachip Semiconductor Corporation (NYSE: MX) (“Magnachip” or the “Company”) today announced financial results for the fourth quarter and full year 2025.

Camillo Martino, Magnachip’s CEO said, “Magnachip has a strong foundation in power semiconductors, built on decades of engineering expertise, trusted customer relationships, and a reputation for quality and reliability. Over the past year, we have taken deliberate actions to simplify the business, significantly reduce our cost structure, and sharpen our focus on power, while increasing investment in new-generation products where we can compete and win.”

Mr. Martino added, “While near-term market conditions remain challenging, the changes we have made are deliberate and structural. With a more focused strategy, a stronger product pipeline, and disciplined execution, we believe Magnachip is better positioned to improve competitiveness, strengthen margins over time, and drive a more consistent recovery.”

Q1 2026 Financial Guidance

While actual results may vary, Magnachip currently expects the following:

Consolidated revenue from continuing operations (which includes Power Analog Solutions and Power IC businesses) to be in the range of $44.0 to $48.0 million, up 13.4% sequentially and up 2.9% year-over-year at the mid-point. This compares with $40.6 million in Q4 2025 and $44.7 million in Q1 2025.
Consolidated gross profit margin from continuing operations to be in the range of 14% to 16%, up from 9.3% in Q4 2025 but down from 20.9% in Q1 2025.

Q4 and Full Year 2025 Earnings Conference Call

Magnachip will host a corresponding conference call at 2:00 p.m. PT / 5:00 p.m. ET today, Wednesday, March 4, 2026, to discuss its financial results. In advance of the conference call, all participants must use the following link to complete the online registration process. Upon registering, each participant will receive access details for this event including the dial-in numbers, a PIN number, and an e-mail with detailed instructions to join the conference call. A live and archived webcast of the conference call and a copy of earnings release will be accessible from the ‘Investors’ section of the Company’s website at www.magnachip.com.

Online registration: https://register-conf.media-server.com/register/BI9d3aea74bb7c44d78d19c946518cef3c

Safe Harbor for Forward-Looking Statements

Information in this press release regarding Magnachip’s forecasts, business outlook, expectations and beliefs are forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 that involve risks and uncertainties. These statements include expectations about estimated historical or future operating results and financial performance, outlook and business plans, including first quarter 2026 revenue and gross profit margin expectations, future growth and revenue opportunities from new and existing products and customers, the timing and extent of future revenue contributions by our products and businesses, and the impact of market conditions associated with inflation and higher interest rates, geopolitical conflicts including between Russia-Ukraine and between Israel, the United States and Iran, sustained military action and conflict in the Red Sea, global macroeconomic conditions resulting from trade and tariff actions instituted between the U.S. and other countries on Magnachip’s future operating results and financial performance, and the potential impacts of emerging technologies such as artificial intelligence on industry dynamics, customer demand, supply chain operations, and regulatory environments. All forward-looking statements included in this release are based upon information available to Magnachip as of the date of this release, which may change, and we assume no obligation to update any such forward-looking statements. These statements are not guarantees of future performance and actual results could differ materially from our current expectations. Factors that could cause or contribute to such differences include, among others: the impact of changes in macroeconomic conditions, including those caused by or related to recent trade and tariff actions announced by the U.S. globally and the related retaliatory tariffs and disruptions in supply chains and global trade as a result thereof, inflation, potential recessions or other deteriorations, economic instability or civil unrest; geopolitical conflicts, including between Russia-Ukraine and between Israel, the United States and Iran and sustained military action and conflict in the Red Sea; disruptions or economic impact resulting from the United States government shutdown, including disruptions at U.S. government agencies caused by reduction in staffing, operations, funding shortages or other concerns that may prevent new products and services from being developed or commercialized in a timely manner or otherwise prevent those agencies from performing normal business functions on which the operation of our customer’s businesses may rely; manufacturing capacity constraints or supply chain disruptions that may impact our ability to deliver our products or affect the price of components, which may lead to an increase in our costs and impact demand for our products from customers who are similarly affected by such capacity constraints or disruptions; the impact of competitive products and pricing; timely acceptance of our designs by customers; timely introduction of new products and technologies; the potential impact of emerging technologies such as artificial intelligence on industry dynamics, customer demand, supply chain operations, and regulatory environments; our ability to ramp new products into volume production; industry-wide shifts in supply and demand for semiconductor products; overcapacity within the industry or at Magnachip; effective and cost-efficient utilization of manufacturing capacity; financial stability in foreign markets and the impact of foreign exchange rates; unanticipated costs and expenses or the inability to identify expenses that can be eliminated; compliance with U.S. and international trade and export laws and regulations by us, our customers and our distributors; change to or ratification of local or international laws and regulations, including those related to environment, health and safety; public health issues; other business interruptions that could disrupt supply or delivery of, or demand for, Magnachip’s products; and other risks detailed from time to time in Magnachip’s filings with the SEC, including our Form 10-K filed on March 14, 2025, and subsequent registration statements, amendments or other reports that we may file from time to time with the SEC and/or make available on our website. Magnachip assumes no obligation and does not intend to update the forward-looking statements provided, whether as a result of new information, future events or otherwise.

About Magnachip Semiconductor

Magnachip is a designer and manufacturer of analog and mixed-signal power semiconductor platform solutions for various applications, including industrial, automotive, communication, consumer and computing. The Company provides a broad range of standard products to customers worldwide. Magnachip, with about 45 years of operating history, owns a substantial number of registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com.View source version on businesswire.com: https://www.businesswire.com/news/home/20260304580132/en/

View source version on businesswire.com: https://www.businesswire.com/news/home/20260304580132/en/

Mike Bishop
Bishop IR, LLC
Tel. +1 (415) 891-9633
mike@bishopir.com

Source: Magnachip Semiconductor Corporation

– Achieves a 26% reduction in chip size and a 31% improvement in R_ss(on)based on Super-Short Channel FET technology

– Expands battery protection solutions for a wide range of mobile devices.

SEOUL, South Korea— Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) today announced the launch of its new 7^th-generation 24V MXT LV MOSFET[1] specifically designed for battery protection circuits in next-generation tri-fold smartphones, strengthening its presence in the premium foldable smartphone market. The product is now in mass production and is currently being supplied to a major global smartphone manufacturer, having demonstrated proven performance and reliability.

The newly introduced 24V Dual N-channel MOSFET (MDWC24D058ERH) incorporates Magnachip’s proprietary Super-Short Channel FET (SSCFET®)[2] technology, reducing chip size by approximately 26% compared to the previous version. This enables manufacturers to reduce the footprint of the battery protection circuit module (PCM) board by more than 20%, allowing the saved space to be used for increased battery capacity or slimmer device designs.

Tri-fold smartphones feature a new form factor that folds twice and operates three displays simultaneously, enabling high-performance multitasking. As a result, their internal structures have become more complex, power-efficient and reliable, while also becoming increasingly critical in design. Accordingly, these devices demand highly integrated and efficient MOSFET solutions to manage complex internal structures while ensuring power stability.

In addition to tri-fold smartphones, the new product can be applied across a wide range of mobile applications, including wearable devices and tablets. It reduces R_SS(on),a major source of power loss, by up to approximately 31%, helping to reduce heat generation. The new product also improves current density per unit area by approximately 48% compared to conventional trench processes, supporting stable voltage control under high-current conditions. In addition, it integrates electrostatic discharge (ESD) protection of more than 2kV, helping to safeguard battery systems from external disturbances.

According to market research firm Omdia, the market for silicon power MOSFETs below 40V, including smartphone batteryFETs, is expected to grow from approximately $4.2 billion in 2025 to approximately $5.2 billion in 2029, representing a compound annual growth rate of about 4.6%. Within this market, the premium smartphone segment, including tri-fold smartphones, is expected to drive growth, supported by increasing demand for high-performance and high-efficiency components.

“Tri-fold smartphones represent high-end mobile devices that require advanced technology and superior component reliability,” said Hyuk Woo, Chief Technology Officer of Magnachip. “Through the supply of this new MOSFET product, we have once again demonstrated Magnachip’s power semiconductor design capabilities and technological competitiveness. Going forward, we will continue to expand our power semiconductor portfolio for a wide range of mobile applications, including smartphones, wearables, and tablets, through ongoing innovation.”

[1] MXT LV MOSFET(Magnachip eXtreme Trench Low Voltage MOSFET): Magnachip’s low-voltage MOSFET product family below 30V based on its latest trench process technology.

[2] SSCFET®(Super-Short Channel FET): Magnachip’s MOSFET design technology that applies a minimized channel-length structure to achieve low on-resistance and high current capability.

Related Links

Power Solutions > MXT MOSFETs > 24V

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Magnachip Expands Production of 7^th-Generation MXT LV MOSFETs Based on Super Short Channel FET Technology

Magnachip Unveils Its First 8th-Generation MXT LV MOSFET Designed with Super-Short Channel FET II

About Magnachip Semiconductor

CONTACTS:

Mike Bishop

United States (Investor Relations)

Bishop IR, LLC

Tel. +1-415-891-9633

mike@bishopir.com

Kyeongah Cho

Global Marketing Communication

Magnachip Semiconductor

Tel. +82-2-6903-3179

pr@magnachip.com

In the Media

Magnachip Launches New 24V BatteryFET for Tri-Fold Smartphone Battery Protection

– Applies Advanced Field Stop Trench Technology
– Reduces Cell Pitch by 40% Compared to Previous Generation
– Increases Product Scalability Through Improved Current Density and Enhanced RBSOA
– Accelerates Market Expansion with Diverse Capacity Lineup

Seoul, January 20, 2026 — Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) today announced the launch of its new series of Insulated Gate Bipolar Transistors (IGBTs) designed for solar inverters and industrial Energy Storage Systems (ESS), further strengthening its position in the high-efficiency power semiconductor market.

The newly introduced 650V and 1200V new Generation Discrete IGBT products are designed for use in solar inverters and ESS applications. By significantly reducing the cell pitch from the previous generation, Magnachip has achieved a substantial increase in current capacity. In addition, the improved Reverse Bias Safe Operating Area (RBSOA) helps to ensure stable and reliable performance under harsh high-voltage and high-current conditions. The products are available in both standard TO-247 and high-capacity TO-247 Plus packages, providing customers with design flexibility for a wide range of applications.

According to market research firm Omdia, the global solar inverter and ESS market is expected to grow from approximately $1.4 billion in 2024 to $2.7 billion in 2029, representing a compound annual growth rate (CAGR) of approximately 10.6%. With global carbon-neutrality initiatives accelerating, energy efficiency and high power density have become key performance metrics in inverter design.

Magnachip already supplies IGBT products to major domestic and international solar inverter manufacturers, earning recognition for high product quality and advanced technology. With this new product launch, the company is expanding its portfolio to cover a wide capacity range — from residential inverters to industrial systems up to 150 kW — allowing customers to select suitable products for their operating environment.

The new generation IGBTs leverage Advanced Field Stop Trench technology, with enhanced design and refined process technology compared to the previous generation. Specifically, the cell pitch has been reduced by approximately 40%, significantly increasing current capacity within the same die area. Furthermore, RBSOA, which defines the semiconductor’s safe operating limits, has been enhanced by over 30%, ensuring robust stability under high-voltage and high-current conditions. This makes it suitable for a wider range of power applications.

Magnachip plans to further expand its product lineup in the first half of 2026 by introducing a high-current series rated up to 650V 150A, as well as new 750V products. The company also plans to add the ‘TO-247-4Lead’ package, featuring a Kelvin pin for improved switching efficiency, further enhancing its IGBT lineup. This will enable Magnachip to offer a broader range of design options for customers in the solar and ESS markets, which are trending toward higher capacity and efficiency.

“This new generation IGBT series enhances efficiency and reliability through refined process technologies,” said Hyuk Woo, CTO of Magnachip. “Building on our market-proven technology and production capabilities, we will continue to expand our solution lineup to better address diverse customer needs.”

Power Solutions > Discrete IGBTs > 1200V

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About Magnachip Semiconductor

Magnachip is a designer and manufacturer of analog and mixed-signal power semiconductor platform solutions for various applications, including industrial, automotive, communication, consumer and computing. The Company provides a broad range of standard products to customers worldwide. Magnachip, with about 45 years of operating history, owns a portfolio of approximately 1,000 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through Magnachip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

Mike Bishop

United States (Investor Relations)

Bishop IR, LLC

Tel. +1-415-891-9633

mike@bishopir.com

Kyeongah Cho

Global Marketing Communication

Magnachip semiconductor

Tel. +82-2-6903-3179

pr@magnachip.com

In the Media

Magnachip Targets Solar and Energy Storage Systems Markets with New Generation of High-Efficiency IGBT Series

Category: News

Magnachip Appoints Chae Lee as Chief Executive Officer

Magnachip Launches New 6th-Generation 600V SJ MOSFETs for AI Servers and EV Charging Applications

Magnachip to Showcase MV MOSFET Portfolio for AI Servers and Data Centers Alongside Its Broader Power Semiconductor Portfolio at PCIM Europe 2026