— Foundry Customers to Benefit from Non-Volatile Memory and BCD Technology —

 

SEOUL, South Korea and SAN JOSE, Calif., May 14, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (MagnaChip Semiconductor) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today the availability of 0.13 micron Multiple-Time Programmable Intellectual Property (MTP-IP) memory cores targeted for mobile and industrial applications.

Jointly developed with Taiwan-based Yield Microelectronics Corporation (YMC), the non-volatile MTP-IP memory core is coupled with MagnaChip’s 0.13 micron mixed signal and BCD technologies to provide global foundry customers with system-on-a-chip performance for embedded microcontrollers capable of being programmed one thousand times.

Demand for embedded and programmable Non-Volatile Memory (NVM) is growing in diverse applications, including autofocus drivers, power management ICs (PMICs) and touch control panels. NVM technology requires zero to two mask layers less than embedded Flash memory, and has a thousand-time programming/erasing capability. As a result, MTP is gaining interest as a highly competitive and cost-effective solution over One-Time Programmable (OTP) solutions. MagnaChip and YMC already have collaborated on MTP solutions in 0.35um to 0.18um tech nodes, and mass-produced a variety of products including MCUs, touch and power management ICs (PMICs).

The new version of non-volatile MTP coupled with 0.13um mixed-signal and BCD technologies offers superior performance as compared with the previous version of our MTP. The MTP solution for 0.13um mixed-signal has achieved 0.061mm2 1Kbits IP size, and due to increasing market demand, lowered the read/write operation range to 1.65V. The dual-cell and ECC designs have greatly enhanced reliability, making them well-suited solutions for auto focus ICs and have potential for applications including Touch and Security. The MTP for 0.13um BCD technology provides high-density 16K*32 MTP + 1K EEPROM IP with ECC design and 40-nanosecond (ns) high-speed access time. The two companies plan to expand this newly developed IP portfolio to meet automotive grade-1requirements, mobile device specifications and for other diverse applications.

“The continued collaboration between MagnaChip and YMC has produced greater innovation and variety in the types of MTP solutions being offered to customers,” said Daniel Huang, YMC’s President. “YMC sees its continued strategic partnership with MagnaChip as a long-term benefit to both YMC’s and MagnaChip’s customers.”

“We are delighted to continue this valuable partnership with Taiwanese IP solution leader YMC,” said YJ Kim, Chief Executive Officer of MagnaChip. “We believe our collaboration will lead to even more cost-efficient, high-functioning NVM solutions to satisfy the increasingly sophisticated needs of global foundry customers for a growing number of diverse applications.”

About Yield Microelectronics Corporation
Yield Microelectronics Corporation (YMC), located in Taiwan’s Chu-Pei city, is a specialized embedded logic multiple-time non-volatile memory (NVM) IP provider. YMC’s innovative NVM MTP-IP products are licensed to design houses and semiconductor foundries, allowing them to integrate crucial non-volatile memory with analog and digital functionality on a single chip. YMC’s NVM IP is characterized by its competitive cell and macro size, adopts logic-based architecture and features the scalability and ease of porting for different technologies and processes such as logic, high-voltage, mixed-mode, bipolar-CMOS-DMOS and many others. For more information, please visit www.ymc.com.tw.

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,200 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com

— 40-Nanometer Rigid Display Driver is Newest OLED DDIC in MagnaChip’s Portfolio —

SEOUL, South Korea and SAN JOSE, Calif., May 1, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, announced today it has launched a new third-generation 40-nanometer (nm) OLED display driver integrated circuit (DDIC) for the next wave of OLED smartphone displays. The new rigid OLED DDIC supports various configurations such as FHD to FHD++, a wide aspect ratio up to 21:9 and bezel-less, edge type, and notch-type OLED displays. The 40nm mobile OLED DDIC already has won its first design-in at a leading smartphone player.

The new 40nm mobile OLED DDIC features lower power consumption and stronger protection against Electrostatic Discharge (ESD) and Electromagnetic Interference (EMI), compared to the second generation OLED DDIC and has enhanced compensation features that further improve color and brightness uniformity.

With the addition of this new third-generation 40nm mobile OLED DDIC, MagnaChip’s current mobile OLED display driver portfolio now includes six display drivers, including three 40nm rigid bezeless drivers, two 55nm flexible bezeless drivers, and one110nm rigid OLED driver.

According to industry observers, OLED technology has become the display technology of choice for leading smartphone makers because it is widely considered to enable thinner, curved and bezel-less mobile displays, offer wider color gamut, higher contrast ratio, faster response time for video and lower power dissipation to reduce heat and preserve battery life as compared with last-generation display technologies.

“The launch of our third-generation 40nm mobile OLED DDIC will help usher in the next wave of OLED smartphones with superior screen features,” said YJ Kim, CEO of MagnaChip. “The 40nm OLED DDIC we have introduced today is the latest mobile OLED DDIC in our current mobile OLED portfolio, and we already are far along in the development of a next-generation 28nm flexible OLED DDIC that we anticipate will be sampled by the end of 2018 or early 2019.”

Since establishing volume production of OLED DDIC products in 2007, MagnaChip OLED DDICs have been adopted in a wide range of smartphones as well as other devices including Virtual Reality Head Mounted Displays.

For more information about OLED DDIC, please visit https://www.magnachip.com/display/oleddisplay.php

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,200 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

United States (Investor Relations):
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

USA media /industry analysts:
Mike Newsom
LouVan Communications, Inc.
Tel. +1-617-803-5385
mike@louvanpr.com

Korea/Asia media
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com

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