Camillo Martino to Continue as Chairman of the Board

 

original Magnachip appoints Chae Lee as Chief Executive Officer, effective July 1, 2026.

 

SEOUL, South Korea–(BUSINESS WIRE)–Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) announced the appointment of Chae Lee as Chief Executive Officer, effective July 1, 2026. Lee is also expected to join Magnachip’s Board of Directors following the effective date of his appointment. Lee succeeds Camillo Martino, who has served as Interim Chief Executive Officer since August 2025 and will continue to serve as Chairman of the Board of Directors.

Lee brings more than 30 years of global semiconductor industry experience spanning power semiconductors, power management integrated circuits (PMIC), sensors, audio amplifiers with expertise in applications, sales, marketing, operations and executive leadership. Most recently, he served as Chief Executive Officer of Tagore Technology, a provider of Gallium Nitride (GaN) semiconductor solutions for Radio Frequency (RF) and Power applications. Prior to Tagore, Lee held senior leadership positions at semiconductor companies including Insyte Systems, NXP Semiconductors, and Maxim Integrated Products where he was responsible for strong high-margin revenue growth through innovative product development in its mobility group.

“Chae has a strong background ideally suited to guide Magnachip through its next phase of growth,” said Camillo Martino, Chairman of the Board. “Chae brings a unique combination of deep technical expertise, operational leadership and commercial experience across both power ICs and system solutions. His experience aligns perfectly with Magnachip’s strategy to strengthen our product portfolio, accelerate innovation and expand our presence in high-value power semiconductor markets.”

Martino added, “On behalf of the Board, I would also like to thank our employees for their dedication and resilience over the past year. I look forward to continuing to work closely with Chae and the management team as Chairman.”

“I am honored to join Magnachip at this important point in its evolution,” said Lee. “Magnachip has a strong heritage in power semiconductors, a talented team, valuable manufacturing assets and on a path to developing compelling next-generation products. I believe the Company is well positioned to capitalize on long-term opportunities across AI, data center, industrial, automotive, robotics, communications, computing and consumer applications. I look forward to working closely with the Board and the entire Magnachip organization to build on the progress already underway and create outstanding value for customers, employees and shareholders.”

 

About Magnachip Semiconductor

Magnachip is a designer and manufacturer of analog and mixed-signal power semiconductor platform solutions for various applications, including industrial, automotive, communication, consumer and computing. The Company provides a broad range of standard products to customers worldwide. Magnachip, with about 45 years of operating history, owns a substantial number of registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through Magnachip’s website is not a part of, and is not incorporated into, this release.

 

Contact: 

Mike Bishop

United States (Investor Relations)

Bishop IR, LLC

Tel. +1-415-891-9633

mike@bishopir.com

Kyeongah Cho

Global Marketing Communication

Magnachip Semiconductor

Tel. +82-2-6903-3179

pr@magnachip.com

 –  Designed for High-Efficiency Power Systems in AI Servers, EV Chargers and Industrial Applications

 –  Low RDS(ON), Fast Recovery Body Diode and Integrated Zener Diode for Enhanced Performance and Reliability

 

SEOUL, South Korea – Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) today announced the introduction of two new 6th-generation 600V Super Junction (SJ) MOSFETs designed to meet the growing performance and efficiency requirements of AI server power applications.

 

The new products feature low RDS(ON) values of 36mΩ and 37mΩ, helping reduce conduction losses and improve overall power conversion efficiency. In addition, both devices integrate a Zener diode between the gate and source terminals to provide enhanced protection against electrostatic discharge (ESD), thereby improving device reliability. The chip size has also been significantly reduced compared with the previous generation, contributing to improved integration and design flexibility.

 

 

The MMTB60R037G6FZVRH incorporates a Fast Recovery Body Diode, which helps reduce reverse recovery losses and improve switching performance in high-frequency power conversion systems. These characteristics make it well suited for AI server power supplies, where efficiency, thermal management, and power density are critical design considerations.

 

Both devices are offered in a TOLL package and are designed for high-power, high-current applications. They also feature a Kelvin Source configuration, which reduces parasitic inductance and improves switching stability.

 

The growing demand for energy-efficient power conversion solutions across AI servers, EV charging systems and industrial power supplies is driving the adoption of advanced power semiconductors. Higher efficiency, improved thermal performance and increased power density have become critical requirements for next-generation power systems.

 

According to Omdia, the discrete semiconductor market within computing & data storage applications is projected to grow from approximately $3.7 billion in 2025 to approximately $5.9 billion by 2030, representing a compound annual growth rate (CAGR) of approximately 9%. The growing adoption of high-density, high-efficiency server power architectures is expected to further drive demand for power discrete devices, including SJ MOSFETs.

 

“As demand continues to grow for more efficient and reliable power systems across AI infrastructure, EV charging systems and industrial applications, power semiconductor performance becomes increasingly important,” said Hyuk Woo, Chief Technology Officer of Magnachip. “Our new 6th-generation 600V SJ MOSFETs combine low on-resistance, enhanced switching characteristics and robust reliability features to help customers improve efficiency and power density in next-generation power designs.”

 

The new SJ MOSFETs are also suitable for a wide range of power applications requiring high efficiency and reliability, including industrial power supplies, telecom infrastructure, and EV charging systems.

 

Related Links

Power Solutions > SJ MOSFETs > 600V

 

Related Articles

Magnachip Launches 650V Super Junction TOLL Package Products with Integrated Kelvin Source

About Magnachip Semiconductor

Magnachip is a designer and manufacturer of analog and mixed-signal power semiconductor platform solutions for various applications, including industrial, automotive, communication, consumer and computing. The Company provides a broad range of standard products to customers worldwide. Magnachip, with about 45 years of operating history, owns a substantial number of registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through Magnachip’s website is not a part of, and is not incorporated into, this release.

 

Contact: 

Mike Bishop

United States (Investor Relations)

Bishop IR, LLC

Tel. +1-415-891-9633

mike@bishopir.com

Kyeongah Cho

Global Marketing Communication

Magnachip Semiconductor

Tel. +82-2-6903-3179

pr@magnachip.com

 

In the Media

Business Wire Logo - Navy - JPEGMagnachip Launches New 6th-Generation 600V SJ MOSFETs for AI Servers and EV Charging Applications