Magnachip Appoints Chae Lee as Chief Executive Officer

Camillo Martino to Continue as Chairman of the Board

 

original Magnachip appoints Chae Lee as Chief Executive Officer, effective July 1, 2026.

 

SEOUL, South Korea–(BUSINESS WIRE)–Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) announced the appointment of Chae Lee as Chief Executive Officer, effective July 1, 2026. Lee is also expected to join Magnachip’s Board of Directors following the effective date of his appointment. Lee succeeds Camillo Martino, who has served as Interim Chief Executive Officer since August 2025 and will continue to serve as Chairman of the Board of Directors.

Lee brings more than 30 years of global semiconductor industry experience spanning power semiconductors, power management integrated circuits (PMIC), sensors, audio amplifiers with expertise in applications, sales, marketing, operations and executive leadership. Most recently, he served as Chief Executive Officer of Tagore Technology, a provider of Gallium Nitride (GaN) semiconductor solutions for Radio Frequency (RF) and Power applications. Prior to Tagore, Lee held senior leadership positions at semiconductor companies including Insyte Systems, NXP Semiconductors, and Maxim Integrated Products where he was responsible for strong high-margin revenue growth through innovative product development in its mobility group.

“Chae has a strong background ideally suited to guide Magnachip through its next phase of growth,” said Camillo Martino, Chairman of the Board. “Chae brings a unique combination of deep technical expertise, operational leadership and commercial experience across both power ICs and system solutions. His experience aligns perfectly with Magnachip’s strategy to strengthen our product portfolio, accelerate innovation and expand our presence in high-value power semiconductor markets.”

Martino added, “On behalf of the Board, I would also like to thank our employees for their dedication and resilience over the past year. I look forward to continuing to work closely with Chae and the management team as Chairman.”

“I am honored to join Magnachip at this important point in its evolution,” said Lee. “Magnachip has a strong heritage in power semiconductors, a talented team, valuable manufacturing assets and on a path to developing compelling next-generation products. I believe the Company is well positioned to capitalize on long-term opportunities across AI, data center, industrial, automotive, robotics, communications, computing and consumer applications. I look forward to working closely with the Board and the entire Magnachip organization to build on the progress already underway and create outstanding value for customers, employees and shareholders.”

 

About Magnachip Semiconductor

Magnachip is a designer and manufacturer of analog and mixed-signal power semiconductor platform solutions for various applications, including industrial, automotive, communication, consumer and computing. The Company provides a broad range of standard products to customers worldwide. Magnachip, with about 45 years of operating history, owns a substantial number of registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through Magnachip’s website is not a part of, and is not incorporated into, this release.

 

Contact: 

Mike Bishop

United States (Investor Relations)

Bishop IR, LLC

Tel. +1-415-891-9633

mike@bishopir.com

Kyeongah Cho

Global Marketing Communication

Magnachip Semiconductor

Tel. +82-2-6903-3179

pr@magnachip.com

  – 专为 AI 服务器、电动汽车充电器及工业应用中的高效率电源系统而设计
  – 低 RDS(ON)、快速恢复体二极管及集成齐纳二极管,实现更高性能与可靠性

 

韩国首尔,2026年6月 —— 美格纳半导体公司(NYSE: MX,“美格纳”)宣布推出两款全新的第六代 600V 超结(SJ)MOSFET。该产品旨在满足 AI 服务器、电动汽车充电系统及工业电源应用对性能与效率不断提升的需求。

新产品具备 36mΩ 和 37mΩ 的低导通电阻,有助于降低导通损耗,并提升整体电源转换效率。此外,两款器件均在栅极与源极之间集成了齐纳二极管,可增强静电放电(ESD)保护能力,从而提升器件可靠性。与上一代产品相比,芯片尺寸也实现了显著缩小,有助于提高系统集成度和设计灵活性。

 

 

其中,MMTB60R037G6FZVRH 集成快速恢复体二极管,可降低反向恢复损耗,并改善高频电源转换系统中的开关性能。这些特性使其非常适用于 AI 服务器电源等对效率、热管理和功率密度要求较高的应用。

两款器件均采用 TOLL 封装,面向高功率、大电流应用设计。同时,产品还采用 Kelvin Source 结构,可降低寄生电感并提升开关稳定性。

随着 AI 服务器、电动汽车充电系统和工业电源领域对高能效电源转换方案的需求持续增长,先进功率半导体的采用正在加速。更高效率、更优热性能和更高功率密度,已成为下一代电源系统的关键要求。

据 Omdia 预测,计算与数据存储应用中的分立半导体市场规模将从 2025 年约 37 亿美元增长至 2030 年约 59 亿美元,复合年增长率约为 9%。高密度、高效率服务器电源架构的普及,预计将进一步推动包括 SJ MOSFET 在内的功率分立器件需求。

美格纳首席技术官禹赫表示:“随着 AI 基础设施、电动汽车充电系统和工业应用对更高效率与可靠性的电源系统需求持续增长,功率半导体的性能正变得越来越重要。我们的第六代 600V SJ MOSFET 结合了低导通电阻、增强的开关特性以及高可靠性设计,可帮助客户提升下一代电源设计中的效率和功率密度。”

该系列新 SJ MOSFET 适用于多种需要高效率和高可靠性的电源应用,包括 AI 服务器电源、工业电源、通信基础设施以及电动汽车充电系统。

 

关链接

电源解决方案  > SJ MOSFETs > 600V

 

相关文章

美格推出集成尔文源 650V TOLL 封装

 

关于美格纳半导体

美格纳是一家致力于模拟及混合信号功率半导体平台解决方案的设计与制造企业,产品广泛应用于工业、汽车、通信、消费电子和计算等多个领域。公司向全球客户提供多样化的标准产品。美格纳拥有逾45年的运营历史,持有大量已注册专利及申请中专利,具备深厚的工程、设计与制造工艺专业实力。如需了解更多信息,请访问 www.magnachip.com/cn。美格纳网站上的信息并非本新闻稿的一部分,亦不构成本新闻稿的内容。

 

系方式:

Mike Bishop

美国(投资者关系部)

Bishop IR, LLC

电话: +1-415-891-9633

mike@bishopir.com

Kyeongah Cho

全球营销传播

美格纳半导体

电话: +82-2-6903-3179

pr@magnachip.com