admin, Author at Magnachip Semiconductor

SEOUL, South Korea and CUPERTINO, Calif., Oct. 10, 2011 — MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced that it will begin supplying display driver ICs to be used in the new AMOLED display panels for Samsung’s Galaxy S2 LTE smartphone.

MagnaChip’s display driver ICs will be used in AMOLED panels that support WVGA (480X800) level resolution and 16M (24bit) colors. The AMOLED panel is designed for the Galaxy S2 LTE 4.5″ model which is based on the next-generation LTE (Long Term Evolution) technology.

The product features MIPI DSI (Mobile Industry Processor Interface Display Serial Interface) designed specifically for smartphone applications and ACL (Automatic Current Limit) which significantly improves performance and power consumption efficiency.

T.Y. Hwang, President and General Manager of MagnaChip’s Display Solutions Division, commented, “We are very excited and proud to have been selected to supply our display driver IC technology for Samsung’s Galaxy S2 LTE smartphone. This is recognition of our product excellence and ability to design and manufacture highly differentiated products which meet the diverse needs of our customers.”

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel.+82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and CUPERTINO, Calif., Oct. 5, 2011 /PRNewswire via COMTEX/ — MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX) will hold a conference call Wednesday, October 26, 2011 at 3 p.m. PDT to discuss the Company’s third quarter 2011 financial results. Participating in the call will be Sang Park, MagnaChip Chairman and CEO and Margaret Sakai, Executive Vice President and CFO. The earnings release will be issued after the market closes that day.

The conference call will be webcast live and is also available by dialing 1-866-776-2061 in the U.S. or 1-706-679-0298 for all other locations. The conference ID number is 16871066 and participants are encouraged to initiate their calls at least 10 minutes in advance of the 3 p.m. PDT start time to ensure a timely connection. The webcast and earnings release will be accessible at https://www.magnachip.com/.

A replay of the conference call will be available the same day and will run for 72 hours. The replay access numbers are 1-800-642-1687 and 1-706-645-9291. The access code is 16871066.

About MagnaChip Semiconductor Corporation

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-3-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and CUPERTINO, Calif., Oct. 3, 2011 — MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, has launched a series of 650V High Voltage (HV) MOSFET products for use in LCD-TV and LCD monitor applications.

The 650V MOSFET is used as a power conversion part for Switched-Mode Power Supplies where flyback topology is adopted. The main applications are typically LCD-TVs and LCD monitors which require high-speed switching. In mission critical situations, the use of power supplies which incorporate the 650V HV MOSFET is essential to securing a stable and regulated supply of power, particularly in countries which experience frequent power supply disruptions.

With the launch of our new series of 650V MOSFETs, MagnaChip Semiconductor will be able to meet the growing customer demand for high voltage MOSFETs used in power supplies and other devices. This also broadens our portfolio of MOSFET products which will now range from 20V up to 650V devices.

HK Kim, Executive Vice President of MagnaChip’s Power Solutions Division said, “We will continue to expand our MOSFET market share and grow our Power Solutions business by accelerating the introduction of new and value added MOSFETs to meet the growing demand of our current and future customer base.”

CONTACTS:

In the United States:

Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:

Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

RIVERSIDE, Calif. and SEOUL, South Korea, Sept. 27, 2011 – MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and Bourns, Inc. (“Bourns”), a leading manufacturer and supplier of electronic components announced today that MagnaChip has ramped to mass production all families of the Bourns® series of high-speed circuit protection devices (TBU® HSP) designed for a broad selection of Industrial, Consumer and Telecommunication applications.

TBU® HSP devices are constructed using MOSFET semiconductor technology. When placed in series in the system, the TBU® HSP device monitors the current flowing through the line. If the current exceeds a preset level, the TBU® HSP device triggers in less than 1 microsecond, providing an effective barrier to large, destructive voltages or currents during surge events, thereby protecting sensitive electronics. These devices are particularly popular in Telecommunication applications (such as Voice SLICs, xPON and GBEthernet), Industrial applications (such as RS485 interfaces, surveillance systems and avionics) and Consumer products applications (such as set top boxes and home gateways).

The TBU® HSP devices are custom designed and developed using Bourns’ proprietary technology fabricated by MagnaChip. MagnaChip successfully transferred two proprietary processes of Bourns needed to produce the TBU® HSP devices by closely working with Bourns’ engineering team. Both processes are currently in the production ramp phase.

TJ Lee, Senior Vice President and General Manager of MagnaChip’s Corporate and SMS Engineering, commented, “We are very pleased to have successfully transferred the Bourns processes to production. We also look forward to supporting their future engineering and manufacturing needs as a partner for our foundry services.”

Arnaud Moser, General Manager of Bourns’ Telecom Segment, added, “We are happy to celebrate this milestone with MagnaChip and look forward to a continued, successful partnership. Thanks to MagnaChip’s engineering expertise and state of the art production facilities, Bourns has been able to bring this innovative technology to a broad array of customers across many markets.”

About MagnaChip

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

About Bourns

Bourns is a leading manufacturer and supplier of automotive sensors, circuit protection solutions, magnetic products, microelectronic modules, trimming and precision potentiometers, panel controls and encoders and resistive products. Headquartered in Riverside, California, USA, Bourns serves a broad range of markets, including telecommunications, computer, industrial, instrumentation, automotive, consumer, non-critical life support medical, audio and various other market segments. Bourns® products are manufactured according to ISO-9000 standards under Six Sigma quality programs. Bourns® automotive products are manufactured in accordance with the TS16949 standard. Additional company and product information is available at the Bourns website www.bourns.com.

Press Contacts

MagnaChip

In the United States:
Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel.+82-2-6903-3195
chankeun.park@magnachip.com

Bourns

Agency Contact:
Annette Keller
Keller Communication
(949) 640-4811
annettekeller@sbcglobal.net

Company Contact:
Mikelyn Bridges
Bourns, Inc.
(951) 781-5397
mike.bridges@bourns.com

Bourns®, TBU® and the Bourns logo are registered trademarks of Bourns, Inc. and may be used only with the permission of Bourns and proper acknowledgement. Other listed names and brands are trademarks or registered trademarks of their respective owners.

SEOUL, South Korea and CUPERTINO, Calif., Sept. 19, 2011 – MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, has launched a series of 4 channel LED drivers for use in LED monitors and LED-TV applications

These new device drivers from MagnaChip are designed to fit the back light unit structures of the latest LED monitors and televisions. Each channel has the equivalent of a 150mA/65V current balance MOSFET embedded in it that is capable of driving up to 20 LEDs in a 40W LED backlight unit.

Operating efficiency and safety have been enhanced through a multitude of designed-in protection functions including current overload protection, LED open/short protection, over voltage protection, open Schottky diode protection and others. The new products are offered in various package and performance options and specifications can be found on the company’s website at www.magnachip.com.

HK Kim, executive vice president of MagnaChip’s Power Solutions Division stated, “There is advanced technology behind the development and launch of all of our new products, including our latest 4-channel LED driver. We intend to continue to innovate and expand the delivery of new and competitive LED driver devices into the 3D TV and Smart TV markets which we see as providing significant growth opportunities for our Power Solutions business.”

CONTACTS:

In the United States:

Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:

Chankeun Park
Senior Manager, Public Relations
Tel.+82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea, Sept. 12, 2011 – MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that it will offer high density metal-insulator-metal capacitor and deep trench capacitor processes for integration into MagnaChip’s standard CMOS mixed signal process.

The high density metal-insulator-metal capacitor process provides capacitance values of 4, 6, 8, and 10fF/um(2). This process replaces the industry standard silicon nitride insulator layer with a high dielectric constant material layer in order to achieve high capacitance per unit area while suppressing leakage current. This high density capacitor can substantially reduce die area in applications that need high total capacitance for the purpose of charge storage and noise decoupling.

The deep trench capacitor consists of an array of small deep trenches constructed into the silicon substrate. This 3-D capacitor has high capacitance of 22 fF/um(2) and breakdown voltage of 25V. This process is specifically optimized to make series resistance low enough for fast switching applications and will be released for production in December 2011.

TJ Lee, Senior Vice President and General Manager of MagnaChip’s Corporate and SMS Engineering stated, “We are very pleased to announce the offering of our specialty capacitor processes such as high density MIM capacitor and deep trench capacitor for feature-rich and cost-effective mixed signal applications. Our goal is to continue to develop highly differentiated and cost-effective technology solutions to meet the increasing application specific needs of our foundry customers.”

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise.

CONTACTS:

In the United States:

Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:

Chankeun Park
Senior Manager, Public Relations
Tel.+82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and CUPERTINO, Calif., Sept. 7, 2011 — MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that Sang Park, MagnaChip’s Chairman and Chief Executive Officer, will be presenting at the Deutsche Bank 2011 Technology Conference in Las Vegas.

The presentation is scheduled for September 13, 2011 at 4:30 p.m. Pacific Time and will be webcast live and archived on MagnaChip’s investor relations website at https://www.magnachip.com/.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-3-6903-3195
chankeun.park@magnachip.com

MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, has launched 27 new low voltage (LV) MOSFET standard devices this year, reinforcing the company’s growing LV MOSFET product portfolio.

The new products include a recently released series of 30V low voltage devices operating in the range of 10amps to 30amps, with a minimized die size made possible through the company’s latest Trench Technology. The new products have improved power efficiency, heat characteristics and switching performance. Customers now have various package size options including DPAK, DFN56, DFN33, SO8, and IPAK, taking into account the unique and diverse design environments encountered.

HK Kim, executive vice president of MagnaChip’s Power Solutions Division commented, “We continue to deliver state of the art MOSFET products addressing the specialized needs of our growing computing, consumer and industrial customer base. We are also planning to launch a dual series device combining both a high-side MOSFET and low-side MOSFET in one package, further enhancing the performance of our new products.”

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest ranges of analog and mixed-signal semiconductor platforms in the industry, supported by the company’s 30-year operating history, its large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise.

CONTACTS:

In the United States:

Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:

Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

MagnaChip Unveils a Zero Layer 10V Triple Voltage CMOS Process for High Performance Mixed Signal Applications

MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it will offer a triple voltage CMOS process to support the integration of off-chip high voltage circuits into standard dual voltage ICs for high performance mixed signal applications.

The triple voltage process consists of an innovative zero layer CMOS transistor design embeddable in the standard 1.8/5V and 1.8/3.3V CMOS processes. The new CMOS transistors have a maximum gate voltage of 7V and maximum drain voltage of 10V in operation with breakdown voltage of over 17V. This process is fully compatible with the standard CMOS process and does not require process changes or additional process steps.

On-resistance of the new transistors is lower than conventional high voltage transistors, including EDMOS and LDMOS that usually incorporate high resistive paths for carriers toward drain contact. Low on-resistance and high breakdown voltage enable IC design flexibility for on-chip integration of analog switches and power amplifiers for high performance mixed signal applications.

TJ Lee, senior vice president and general manager of MagnaChip’s Corporate and SMS Engineering stated, “We are pleased to offer a zero layer 10V triple voltage CMOS process for mixed signal applications. This is a big step towards achieving leadership with our premium mixed signal processes, including triple gate oxide and ultra low noise processes already in production. We will continue to provide process solutions for the application specific needs of our foundry customers.”

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise.

CONTACTS:

In the United States:

Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:

Chankeun Park
Senior Manager, Public Relations
Tel.+82-2-6903-3195
chankeun.park@magnachip.com

MagnaChip Semiconductor Corporation (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that the Company’s Board of Directors has appointed Ilbok Lee as a new Independent Director. Dr. Lee has been President and Chief Executive Officer of Silego Technology, Inc., a semiconductor company, since its inception in October 2001.

From 1999 to 2001, Dr. Lee served as Senior Vice President and General Manager of the Timing Division at Cypress Semiconductor Corp., and from 1992 to 1999 served as President and Chief Executive Officer of IC Works, Inc., a semiconductor company he co-founded that was acquired by Cypress in 2001.

Dr. Lee co-founded Samsung Semiconductor, Inc. (U.S.A.) in 1983 and served in various positions at the company, including President and Chief Executive Officer, until 1992. Prior to Samsung, Dr. Lee served in various technical and managerial positions at Intel and National Semiconductor. Dr. Lee received a Ph.D. and M.S.E.E. from the University of Minnesota and a B.S.E.E. from Seoul National University.

“We are pleased to have Ilbok join our Board as a new Independent Director,” stated Sang Park, MagnaChip’s Chairman and Chief Executive Officer. “His industry experience and knowledge will prove invaluable as we continue to execute on our business plan and position MagnaChip for long-term, profitable growth.”

Dr. Lee’s appointment fills the vacancy created by Gidu Shroff, who resigned from the Board to focus more time on personal pursuits.
Park continued, “On behalf of the Board, I want to thank Gidu for his service to MagnaChip and the contributions he has made to the Company. His dedication and support are greatly appreciated. We wish him well.”

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip Semiconductor’s website is not part of, and is not incorporated into, this release.

CONTACTS:

In the United States:

Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:

Chankeun Park
Senior Manager, Public Relations
Tel.+82-2-6903-3195
chankeun.park@magnachip.com

Author: admin

Magnachip to Supply AMOLED Display Driver ICs for the Samsung Galaxy S2 LTE Smartphone

Magnachip Schedules Third Quarter 2011 Earnings Release and Conference Call

Magnachip Unveils 650V High Voltage MOSFETs Targeted for the LCD Television and Monitor Market

Bourns and Magnachip Announce Volume Ramp of TBU? Series of High-Speed Circuit Protection Devices

Magnachip Unveils 4-Channel LED Drivers Targeted for the Advanced Display and Television Market

Magnachip to Include Specialty High Density Capacitor Processes With Its Standard CMOS Mixed Signal

Magnachip to Present at the Deutsche Bank 2011 Technology Conference

Magnachip Unveils New Low Voltage MOSFETs Targeted for the Computing Market

Magnachip Unveils a Zero Layer 10V Triple Voltage CMOS Process for High Performance Mixed Signal App

MagnaChip Unveils a Zero Layer 10V Triple Voltage CMOS Process for High Performance Mixed Signal Applications

Magnachip Appoints Dr. Ilbok Lee as New Independent Director