admin, Author at Magnachip Semiconductor

SEOUL, South Korea and CUPERTINO, Calif., Jan. 30, 2012 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and GMT (Global Mixed-mode Technology), a leading fabless provider of power solutions for mobile phone and PC applications, today announced that MagnaChip has ramped to mass production GMT’s power management IC (PMIC) products utilizing 0.35um BCD (Bipolar CMOS-DMOS) process technology.

MagnaChip and GMT have been engaged in the development of PMIC and LED Driver IC products using 0.35um 65V BCD process technology at MagnaChip’s manufacturing facility located in Cheongju, South Korea. MagnaChip has successfully completed the final qualification of PMIC products which have ramped to high-volume production, while the LED driver IC products are currently under development.

The PMIC manages multiple power levels for LCD TV and monitor applications. GMT’s PMIC incorporates a high-performance linear regulator, low-power charge-pump regulators, a high current operational amplifier and a logic-controlled gate-on pulse modulator to control the positive charge-pump output sequence and waveform. MagnaChip is uniquely positioned as a foundry provider to be able to offer the deep trench isolation technology for PMIC applications.

In addition to the PMIC, GMT’s LED Driver IC has the ability to drive up to 12 parallel strings of LEDs at a maximum of 120mA of current. It also provides a precision current balance function for each LED string. Additionally, the LED string voltages can be up to a maximum of 65V. This makes it very suitable to be used in main stream (40 inch ~ 55 inch) LED TV back light applications.

Namkyu Park, Vice President of MagnaChip’s Foundry Marketing commented, “We are very pleased to announce MagnaChip’s production ramp of GMT’s PMIC products using our 0.35um BCD process technology. The continued introduction of these robust PMIC solutions is a direct result of the combined expertise of MagnaChip’s manufacturing services and GMT’s design engineering. We will continue to develop highly differentiated and cost-effective BCD technology solutions to meet the increasing application specific needs of our foundry customers.”

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

About GMT Incorporated
Headquartered in Hsinchu Science Park Taiwan, GMT (Global Mixed-mode Technology) was founded in 1996 as a dedicated analog IC design and power solution provider. GMT is a leader in power solutions with a focus on Notebook PC, Server, Workstation and 3C consumer products including mobile phone, networking and LCD products. GMT has been publicly listed on the TWSE since 2004. Please visit http://www.gmt.com.tw/ for more information.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX) today announced that its Korean subsidiary has entered into a definitive agreement to acquire Dawin Electronics Co. Ltd., a privately held semiconductor company that designs and manufactures Insulated Gate Bipolar Transistor (IGBT), Fast Recovery Diode (FRD) and MOSFET modules. Dawin Electronics is headquartered in Incheon, South Korea, and has sales offices in China and Europe. Terms of the deal were not disclosed.

“The acquisition of Dawin Electronics is a strategic fit for MagnaChip and allows us to continue to diversify and expand our fast-growing Power Solutions business into the commercial and industrial segments,” said Sang Park, MagnaChip’s Chairman and CEO. “Dawin’s high-power modules will enable MagnaChip to compete quickly and effectively in the high-growth IGBT market with a broader portfolio of power solutions for our customers. This acquisition also demonstrates our continued focus on capital allocation and commitment to return shareholder value to our investors.”

According to market research firm IHS iSuppli, the total IGBT market in 2011 was estimated to be $4.1 billion and is expected to grow at a compounded annual growth rate of 10 percent from 2011 to 2015. The IGBT is used in a broad range of medium- to high-power commercial and industrial applications and in many consumer appliances such as variable speed refrigerators, air-conditioners and stereo systems. Availability of affordable, reliable IGBTs is also an important enabler for electric vehicles and hybrid cars.

The acquisition of Dawin and its IGBT and FRD module technology is synergistic with MagnaChip’s goal of expanding into high-growth, high-margin markets and with its long history as a designer and manufacturer of analog and mixed-signal semiconductor products. The acquisition is expected to be completed before the end of March 2012.

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

About Dawin Electronics

Dawin Electronics, founded in 2001, is a Korea-based designer and manufacturer of FRD, IGBT and MOSFET modules for consumer, commercial and industrial applications. For more information, please visit www.dawinsemi.com.

Safe Harbor for Forward-Looking Statements

Information in this release regarding MagnaChip Semiconductor Corporation’s forecasts, business outlook, expectations and beliefs are forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 that involve risks and uncertainties. These statements include statements about our ability to capitalize on improving market dynamics and future operating and financial performance including revenue. All forward-looking statements included in this release are based upon information available to MagnaChip Semiconductor as of the date of this release, which may change, and we assume no obligation to update any such forward-looking statements. These statements are not guarantees of future performance and actual results could differ materially from our current expectations. Factors that could cause or contribute to such differences include general economic conditions, the impact of competitive products and pricing, timely design acceptance by our customers, timely introduction of new products and technologies, ability to ramp new products into volume production, industry wide shifts in supply and demand for semiconductor products, industry and/or company overcapacity, effective and cost efficient utilization of manufacturing capacity, financial stability in foreign markets and the impact of foreign exchange rates, unanticipated costs and expenses or the inability to identify expenses which can be eliminated, compliance with U.S. and international trade and export laws and regulations by us and our distributors, and other risks detailed from time to time in MagnaChip Semiconductor Corporation’s filings with the SEC, including our Form 10-K filed on March 18, 2011 and subsequent registration statements, amendments or other reports that we may file from time to time with the SEC and/or make available on our website. MagnaChip Semiconductor Corporation assumes no obligation and does not intend to update the forward-looking statements provided, whether as a result of new information, future events or otherwise.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and CUPERTINO, Calif., Jan. 11, 2012 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX) will hold a conference call Wednesday, February 1, 2012 at 3 p.m. PST to discuss the Company’s fourth quarter 2011 financial results. Participating in the call will be Sang Park, MagnaChip Chairman and CEO and Margaret Sakai, Executive Vice President and CFO. The earnings press release will be issued after the market closes that day.

The conference call will be webcast live and is also available by dialing 1-866-776-2061 in the U.S. or 1-706-679-0298 for all other locations. The conference ID number is 42555239 and participants are encouraged to initiate their calls at least 10 minutes in advance of the 3 p.m. PST start time to ensure a timely connection. The webcast and earnings release will be accessible at www.magnachip.com.

A replay of the conference call will be available the same day and will run for 72 hours. The replay access numbers are 1-855-859-2056 or 1-404-537-3406. The access code is 42555239.

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and CUPERTINO, Calif., Jan. 9, 2012 — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that it now offers a vertical BJT (Bipolar Junction Transistor) type ESD (Electro-Static Discharge) clamp to shrink products in 0.35um advanced BCD (Bipolar/CMOS/DMOS) technology with DTI (Deep Trench Isolation).

The vertical BJT ESD clamp, which is compatible with MagnaChip’s deep trench isolation process, was developed to support the industry’s first advanced BCD technology that enables DTI. The vertical BJT clamp features a snapback operating by BJT action and reduces the ESD clamp area by up to 84% when compared with conventional diode types.

T.J. Lee, Executive Vice President and General Manager of MagnaChip’s Corporate Engineering Division, commented, “We are very pleased to announce the introduction of our new ESD device developed for cost-effective and robust applications. Our offering of ESD devices such as the vertical BJT type ESD clamp is intended to enhance the competitiveness and design flexibility of our customer’s products. Our goal is to continue to develop highly differentiated and cost-effective ESD solutions to meet the increasing application-specific needs of our foundry customers.”

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and CUPERTINO, Calif., Dec. 19, 2011 – MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), an Asia-based foundry, designer and manufacturer of analog and mixed-signal semiconductor products, announced that it will begin supplying display driver ICs to be used in the AMOLED display panels for multiple Microsoft Windows-based smartphones.

MagnaChip’s display driver ICs will be used in AMOLED panels that support WVGA (480X800) level resolution and 16M (24bit) colors. The product features MIPI DSI (Mobile Industry Processor Interface Display Serial Interface) high-speed serial interface technology designed specifically for smartphone applications. The display driver ICs will also include ACL (Automatic Current Limit) which significantly improves performance and power consumption efficiency.

T.Y. Hwang, President and General Manager of MagnaChip’s Display Solutions Division, commented, “Display driver ICs have grown as a percent of our total design-win portfolio from one percent in 2010 to ten percent in 2011. Supplying AMOLED display driver ICs allows us to strengthen and expand our strategic partnerships with top tier global smartphone manufacturers, as we continue our focused research and development efforts in this area.”

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and CUPERTINO, Calif., Dec. 12, 2011 – MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that it now offers a redistribution layer (RDL) metal process for wafer bumping and an IO structure and process that is fully compatible with copper wire bonding. This process is designed to reduce semiconductor packaging costs while meeting the specialized application needs of foundry customers.

The redistribution layer metal process converts wire bond pads at the perimeter of the die to an array of bump pads that are relocated to the center area of the die. The relocation of pads allows for a larger pad pitch for wafer bumping making it possible to use low cost solder bumps instead of plated bumps. The redistributed bond pad process has recently found its way into other advanced packaging methodologies such as wafer-level chip-scale packaging, system-in-package, and 3-D packaging. This process requires one additional aluminum layer and is fully compatible with MagnaChip’s standard CMOS process.

Related to packaging trends, copper versus gold wire bonding has become one of the preferred methods for semiconductor interconnection because of its cost and performance features. Copper is a lower cost alternative to gold for packaging applications and has higher electrical and thermal conductivity making copper wire an excellent bonding material. In addition, copper bonds have greater reliability at elevated temperatures than gold bonds because of its lower tendency to form intermetallic compounds. One of the major challenges of copper wire bonding had been the significant mechanical stress imposed on bonding pads. This stress often resulted in dielectric cracks beneath the pads. MagnaChip resolved this issue in cooperation with the major packaging companies, including Amkor.

T.J. Lee, Senior Vice President and General Manager of MagnaChip’s Corporate Engineering stated, “We are very pleased to announce the offering of cost competitive backend processes such as the redistribution layer metal process and copper wire bonding. Our goal is to continue to develop highly differentiated and cost-effective technology solutions to meet the increasing application specific needs of our foundry customers.”

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and CUPERTINO, Calif., Dec. 5, 2011 – MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that it now offers module based process design kits (PDK) designed specifically to support power and large display driver IC design applications.

MagnaChip’s PDK supports a diverse set of design requirements used for product development based on the company’s advanced process technologies. The process design kits incorporate design rule documentation, spice model for circuit design, schematic symbol typology, PCell (parameterized cell), DRC for layout design, LVS, LPE, and other technical files.

MagnaChip began development of the Modular PDK set methodology at the beginning of 2010. Currently, standardization of design rule documents, standard test patterns and modular DRC/LVS are now being applied to power and large display driver IC applications.

The advantage of a modular PDK approach is the fast provisioning of quality process design kits through the use of verified standardized modules for each technology. Another advantage of MagnaChip’s PDK is that it features user-friendly functions such as one click downloads and installs which enhance the customer’s experience. In addition, development time when using MagnaChip’s newly launched PDK sets can be reduced by more than 50% as a result of the modular and pre-standardization approach to design.

T.J. Lee, Senior Vice President and General Manager of MagnaChip’s Corporate Engineering commented, “We are very pleased to announce the offering of our module based process design kits for power and large display driver IC applications. By using a modular PDK approach, MagnaChip can dramatically reduce the cycle time for PDK development and verification. As a result, we provide enhanced cost competitiveness and design flexibility while continuing to provide user-friendly and cost-effective PDKs for our foundry customers.”

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit https://www.magnachip.com/.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

MagnaChip to Present and Discuss Growth Opportunities and Strategies at the Barclays Capital Global Technology Conference

SEOUL, South Korea and CUPERTINO, Calif., Nov. 30, 2011 – MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that Sang Park, MagnaChip’s Chairman and Chief Executive Officer, will be presenting and discussing the company’s growth opportunities and strategies at the Barclays Capital Global Technology Conference in San Francisco.

The presentation is scheduled for December 7, 2011 at 9:00 a.m. Pacific Time and will be webcast live and archived on MagnaChip’s investor relations website at www.magnachip.com.

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea, Nov. 7, 2011 — MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that it now offers cost competitive compact standard cell libraries targeting low power applications in 0.18um and 0.35um technologies.

The new standard cell library features a smaller cell area and lower operating power by incorporating a compact design architecture. The cell area is reduced by up to 25% and the operating power consumption by a maximum of 60% compared with the use of conventional design libraries. In addition, these new compact standard cell libraries have the advantage of increased speed in addition to leakage and latch up control when compared to previous compact standard cell libraries. Any weakness to latch up is sharply reduced by using a self-well bias contact scheme.

T.J. Lee, Senior Vice President and General Manager of MagnaChip’s Corporate and SMS Engineering commented, “We are very pleased to announce the offering of our competitive compact standard cell library for cost effective and low power applications These cell libraries will provide cost competitiveness and design flexibility to meet the increasing application specific needs of our foundry customers.”

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:

Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:

Chankeun Park
Senior Manager, Public Relations
Tel.+82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and CUPERTINO, Calif., Oct. 31, 2011 — MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), an Asia-based designer and manufacturer of analog and mixed-signal semiconductor products, has launched a 4-channel LED driver for notebook computer applications and a 6-channel LED driver for tablet PCs.

The 4-channel LED driver, MAP3105, has an input voltage range of 4V to 26V and an embedded MOSFET which can boost output voltage to as much as 45V with a switching range of 500KHz ~2MHz. MAP3105 also maximizes LED brightness by increasing input current up to 40mA per channel, while minimizing current matching to less than 2% per channel. MAP3105 is offered in a TQFN-16L package and is 3mm x 3mm in size.

In addition, the 6-channel LED driver, MAP3106, has an input voltage range of 5V to 24V and an embedded MOSFET which can boost output voltage to as much as 40V with a switching range of 330KHz ~1MHz. MAP3106 is offered in a QFN package and is 4mm x 4mm in size.

Operating efficiency and safety have also been enhanced through a multitude of designed-in protection functions including current overload protection, LED open/short protection, over voltage protection, open Schottky diode protection among others. Detailed performance options and specifications can readily be found on the company’s website at www.magnachip.com.

H.K. Kim, Executive Vice President of MagnaChip’s Power Solutions Division said, “We are very pleased to have launched the fully integrated 4-channel and 6-channel LED backlight driver which expands our product portfolio of drivers for notebook and tablet PCs. Our goal is to continue to deliver leading-edge products by expanding our product portfolio with the latest in advanced technologies.”

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is an Asia-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:

Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:

Chankeun Park
Senior Manager, Public Relations
Tel.+82-2-6903-3195
chankeun.park@magnachip.com

Author: admin

Magnachip and GMT Announce Volume Ramp of GMT’s Power Management IC for LCD TV

Magnachip to Acquire Dawin Electronics, Designer and Manufacturer of Power Modules

Magnachip Schedules Fourth Quarter 2011 Earnings Release and Conference Call

Magnachip to Offer Cost Competitive Vertical Bipolar Junction Transistor Type ESD Device

Magnachip to Supply AMOLED Display Driver ICs for Microsoft Windows-Based Smartphones

Magnachip to Offer Cost Competitive Redistribution Layer Metal Process and Copper Wire Bonding

Magnachip Launches Module Based Process Design Kits for Power and Display Driver Applications

Magnachip to Present and Discuss Growth Opportunities and Strategies at the Barclays Capital Global

MagnaChip to Present and Discuss Growth Opportunities and Strategies at the Barclays Capital Global Technology Conference

Magnachip to Offer Cost Competitive Compact Standard Cell Library for Low Power Applications

Magnachip Expands its LED Driver Product Portfolio to Notebook and Tablet PCs