SEOUL, South Korea and CUPERTINO, Calif., Oct. 21, 2013 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it now offers a new 0.35um silicon-on-insulator (SOI) based Bipolar-CMOS-DMOS (BCD) high voltage process. This new process features 8V to 16V fully isolated high voltage devices that are implemented on SOI substrates for applications that include audio amps, DC-DC converters, and PMICs for the mobile and consumer markets.
This process also supports standard 3.3V and 5V CMOS digital, mixed-signal and analog devices. The high voltage 8V to 16V devices are optimized to have low Rsp (specific on-resistance) and low capacitance, for applications requiring power stages. Integrating CMOS and high voltage devices on SOI substrates with deep trench isolation (DTI) offers minimum isolation and device area, minimum substrate leakage, improved radiation hardness and high-temperature operation. This enables the design of PMICs with unipolar or bipolar supplies (positive and negative supply rails), with latch-up free operation.
“We are very pleased to offer our new 0.35um BCD high voltage process solution based on silicon-on-insulator substrates,” said Namkyu Park, Senior Vice President of Marketing for MagnaChip’s Semiconductor Manufacturing Services Division. “We intend to expand our SOI based BCD portfolio with additional voltage ratings to continue to support the growing applications that can benefit from the isolation feature of this process.”
About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.
CONTACTS:
In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com
In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com
