SEOUL, South Korea and CUPERTINO, Calif., Jan. 9, 2012 — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that it now offers a vertical BJT (Bipolar Junction Transistor) type ESD (Electro-Static Discharge) clamp to shrink products in 0.35um advanced BCD (Bipolar/CMOS/DMOS) technology with DTI (Deep Trench Isolation).
The vertical BJT ESD clamp, which is compatible with MagnaChip’s deep trench isolation process, was developed to support the industry’s first advanced BCD technology that enables DTI. The vertical BJT clamp features a snapback operating by BJT action and reduces the ESD clamp area by up to 84% when compared with conventional diode types.
T.J. Lee, Executive Vice President and General Manager of MagnaChip’s Corporate Engineering Division, commented, “We are very pleased to announce the introduction of our new ESD device developed for cost-effective and robust applications. Our offering of ESD devices such as the vertical BJT type ESD clamp is intended to enhance the competitiveness and design flexibility of our customer’s products. Our goal is to continue to develop highly differentiated and cost-effective ESD solutions to meet the increasing application-specific needs of our foundry customers.”
About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.
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