• Data Processing

    Pattern Generation from coded databases, necessary data handlings, and post-checkings are performed.

    Frame Layout Work

    Considering wafer process, align mark, in-line monitoring pattern, test module and various other keys in scribe lane are arranged.

  • Purchase Order
    Data Type
    - Layout Data: GDS-II Format
    - MASK Data: MEBES Format
    Data Information (Tooling Sheet)
    - CAD Information for GDS-II Data
    from Customers
    - Tooling Information for E-Beam Data
    from MagnaChip
    - Data Conversion
    (GDS-II Format into MEBES Format)
    Related Information Needed
    - Pellicle Type
    - Mask Type: 1x,2x,4x,5x / 5", 6" / Normal, PSM
    - Mask Spec.
    - Frame Pattern (Test Module, etc.)
    - Due Date

  • Mask Type Blank Material Mask Dimension Stepper
    Cr Mask 5" Quartz + Cr 5"_5"_0.09" 5x(I,G-line)
    Cr Mask 6" Quartz + Cr 6"_6"_0.25" 4x,5x(I-line,KrF)
    H/T*PSM Quartz + MoSION + Cr 6"_6"_0.25" 4x(KrF)