|
|
-
Data Processing
Pattern Generation from coded databases, necessary data handlings, and post-checkings are performed.
Frame Layout Work
Considering wafer process, align mark, in-line monitoring pattern, test module and various other keys in scribe lane are arranged.
-

Purchase Order
Data Type
- Layout Data: GDS-II Format
- MASK Data: MEBES Format
Data Information (Tooling Sheet)
- CAD Information for GDS-II Data
from Customers
- Tooling Information for E-Beam Data
from MagnaChip
- Data Conversion
(GDS-II Format into MEBES Format)
Related Information Needed
- Pellicle Type
- Mask Type: 1x,2x,4x,5x / 5", 6" / Normal, PSM
- Mask Spec.
- Frame Pattern (Test Module, etc.)
- Due Date
-
| Mask Type |
Blank Material |
Mask Dimension |
Stepper |
| Cr Mask 5" |
Quartz + Cr |
5"_5"_0.09" |
5x(I,G-line) |
| Cr Mask 6" |
Quartz + Cr |
6"_6"_0.25" |
4x,5x(I-line,KrF) |
| H/T*PSM |
Quartz + MoSION + Cr |
6"_6"_0.25" |
4x(KrF) |
|