Microsemi Partners with MagnaChip on Process Technology

Optimized for Its Commercial Growth Markets

 

 

Microsemi Enhances Portfolio with Mixed-Signal Semiconductor Process Tuned for

LED and CCFL Backlighting, Power-over-Ethernet, Power Conversion and Solid State Lighting

 

 

IRVINE, Calif., January 26, 2009 -- Microsemi Corporation (Nasdaq:MSCC), a leading manufacturer of high performance analog/mixed signal integrated circuits and high reliability semiconductors, today announced it has partnered with specialty foundry provider MagnaChip Semiconductor LLC to develop advanced mixed-signal process technology that is optimized for products in Microsemi’s key commercial growth markets.  The new process is electrically compatible with MagnaChip’s own 0.35-micron baseline process that is already used by Microsemi to manufacture current products.

Microsemi and MagnaChip have completed a 24-month joint R&D project for a 0.35-micron, 72 volt (V) version of MagnaChip’s proven power process technology, which combines Bipolar technology for analog control, Complementary metal-oxide semiconductor (CMOS) technology for digital control, and Diffused MOS (DMOS) technology for handling the high currents required for managing on-chip or system power. One of the advanced features of this Bipolar CMOS DMOS (BCD) process is its innovative deep trench isolation technique, which reduces transistor pitch and off-state leakage current while improving latch-up immunity, resulting in a higher degree of integration for complex power management ICs.

The enhanced BCD process technology includes proprietary Microsemi devices and structures that are optimized for its targeted product applications to reduce die size, improve overall analog performance, and enhance device performance in high-current situations.  The two companies are also working on a second enhanced process technology for additional product applications, which will be released after designs have been validated.

“This is a first key step in expanding our technology portfolio to include a variety of custom processes for the next generation of LED and CCFL lighting products as well as many other future product areas” said James Aralis, Microsemi Vice President of R&D.  “The combination of these processes and custom device technologies with our world-class system and IC design capabilities will enable our team to develop highly differentiated and cost-effective products for customers across the full range of our targeted market segments.”

Dr. T.J. Lee, Senior Vice president of MagnaChip Semiconductor Manufacturing Services Engineering, commented “Our goal is to build solid, strategic relationships with foundry customers through outstanding customer service and high quality products.  Microsemi exemplifies these types of customers and we are very pleased to partner with industry leader Microsemi to develop our 0.35-micron advanced BCD process.  The successful partnership between MagnaChip and Microsemi has demonstrated MagnaChip’s capability of providing truly leading edge BCD processes to support our customers’ growth.”

The Microsemi and MagnaChip advanced BCD process will improve time-to-market for new product development, while enabling the ongoing re-use of all proven low-voltage blocks and cells that Microsemi has adopted for existing products.  Microsemi currently has five new products in the final stages of development using the new BCD process, four of which are now being tested and validated both internally and by customers.  All five products have benefitted from the improved performance and cost associated with the enhanced BCD process.