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    Date   2016/11/14
    Subject   MX to Offer 0.13 micron EEPROM based RF-CMOS Technology for Wireless Applications

MagnaChip to Offer 0.13 micron EEPROM based RF-CMOS Technology for Wireless Applications
 


SEOUL, South Korea and SAN JOSE, Calif., Nov. 14, 2016 /PRNewswire/ -- MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers 0.13 micron EEPROM- based RF-CMOS technology. This RF-CMOS process was developed using a P-type substrate, which is tailored specifically for wireless applications.

The primary purpose for developing the 0.13 micron EEPROM based RF-CMOS technology is to support Smart Wireless MCU products, which frequently use BLE (Bluetooth Low Energy) as the main wireless communications technology. BLE, also called Bluetooth Smart, is a Bluetooth technology that transmits and receives low-power and low-capacity data, reaching a radius of 10 meters using the 2.4GHz frequency range. To satisfy this market need, MagnaChip has developed a process applicable for Smart Wireless MCU products with embedded RF devices in the 0.13 micron EEPROM process. MagnaChip's technology, which consumes less power, makes it suitable for various applications that utilize Smart Wireless MCUs, such as smartwatches, smart remote controllers, toys, beacons, wearables, 3D glasses and sensor hub wireless chargers.

Furthermore, MagnaChip's RF-CMOS technology includes the necessary components such as RF-CMOS devices and passive devices including EEPROM IP. The EEPROM IP is also usable up to 64K bytes of high density. Also, RF modeling for CMOS, HR resistor, MIM capacitor, MOM capacitor, varactor diodes and inductor components was completed for the RF design, and the 4-micron-thick metal process was developed for the RF design. In particular, low Vt N/PMOS was developed to improve the transistor's RF performance.

To capitalize on the many beneficial features, such as efficient power consumption and wide usability, MagnaChip has been developing various RF-CMOS technologies and will begin full-scale mass production in 2017. MagnaChip is offering RF-SOI and also RF-CMOS processes, which demonstrates that the company has made significant progress in becoming an RF process specialty foundry. Due to increased usage of Smart Wireless MCU products in smart homes, the MCU market is expected to show significant growth in the near future, according to industry observers.

YJ Kim, MagnaChip's Chief Executive Officer, commented, "We are pleased to offer our 0.13 micron EEPROM based RF-CMOS technology for applications in the Smart Wireless MCU market. Our goal is to continue to develop competitive processes and IPs to serve growing markets and to diversify our technology portfolio to meet the many application-specific needs of our foundry customers."

About MagnaChip Semiconductor
MagnaChip is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high-volume consumer, communication, industrial and computing applications. The Company's Display Solutions, Power Solutions, and Foundry Services Groups provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip owns a portfolio of more than 3,500 registered and pending patents, and has extensive engineering, design and manufacturing process expertise resulting from its 30-year operating history.

For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip's website is not a part of, and is not incorporated into, this release.


CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

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